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The silicon cleanroom is currently operating on 100mm substrates, but all recent equipment acquisitions can be upgraded to 150 or 200mm capability. There has been significant recent investment in enhanced etch capability, chemical mechanical polish (CMP) and improved implantation facilities.

The laboratory is also ideally set up for process development or prototyping of novel devices. The current silicon wafer-processing has an optical lithography capability to below 1 micron features with the JEOL electron beam system providing deep sub-micron lithography capability.

Case Studies: Radiation Microsensors for Cancer Therapies

Technology developed in the Silicon Fabrication Facility forms a critical component of the world’s first implantable radiation sensor for use in cancer therapy. The U.S. Food and Drug Administration (FDA) has cleared Sicel Technologies of North Carolina for an implantable radiation monitoring device using radiation detection technology developed at Tyndall. Sicel Technologies’ DVS Ò (Dose Verification System) device measures the day-to-day and cumulative radiation dose given during a course of treatment and has the unique capability to pinpoint the tumour target during a patient’s treatment cycle. This is a critical advance in cancer treatment as too low a dose fails to sufficiently damage the tumour and too high a dose can damage surrounding living tissue. Each implanted DVS Ò unit contains two radiation detection chips (i.e. RADFETs) fabricated at Tyndall.

Case Studies: Silicon Photonics for Applications in Biomedical Diagnostics, Laser-ranging and Night-imaging

Through the close working relationship established between SensL and the Tyndall Silicon Fabrication Facility, a silicon photomultiplier has been developed and is on the market as SensL's SPM product range. SensL is a Tyndall spin-out and through a commercial agreement utilises the facilities, and has license to the low light detector technologies developed at the Institute over the last decade.A new, array-based photodetector, developed in close collaboration between the process engineering team at Tyndall and the engineering group at SensL, permits larger sensor arrays with improved collection efficiencies and signal resolution for low light, sensor applications. This technology will lead to a new generation of photon counting arrays and imagers for applications in laser ranging, night imaging and biomedical diagnostics.

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