The development work on the integration of magnetic components on Silicon is underpinned by significant experience in the design and optimization of electromagnetic devices using finite element anaysis and analytical tools. There is also a strong emphasis on the development of analytic models for electromagnetic devices with a view to optimisation. The images below compare the results from an analytical based model for the calculation of skin and proximity loss in inductor windings, to results obtained from a Finite Element simulation.

 Current density distribution in high aspect ratio inductor winding from FEA

Current density distribution in high aspect ratio inductor winding from FEA

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Contact: Ningning Wang – ning.wang@tyndall.ie  | webpage

Projects:

• Power Supply on Chip (PSOC) : funded under the Enterprise Ireland CFTD/03/322 project.
• Micro-fabricated inductors : funded under the Enterprise Ireland Industry Led research Programme, ILRP/05/PEIG1
• Driver technologies: Funded under the Enterprise Ireland Industry Led research Programme, ILRP/05/PEIG4

Selected Publications

• N. Wang, T. O’Donnell, S. Roy, S. Kulkarni, P. McCloskey, S.C.O’Mathuna, “Thin Film Micro-transformer Integrated on Silicon for Signal Isolation”, IEEE Trans. Magnetics, Volume 43, Issue 6, June 2007 Page(s):2719 – 2721.
• N. Wang, T.O’Donnell, S. Roy, P. McCloskey, S.C.O’Mathuna, “Micro-inductors integrated on Silicon for Power supply on chip”, Journal of Magnetism & Magnetic Materials, 2007, in press.
• M. Brunet, T. O’Donnell, A.M. Connell, P. McCloskey, S.C. O’Mathuna, “Electrochemical Process for the Lamination of Magnetic Cores in Thin-Film Magnetic Components”, Journal of Microelectromechanical Systems, vol. 15, no. 1, Feb 2006, pp 94-100.
• S.C. O’Mathuna, T. O’Donnell, N. Wang, K. Rinne, 'Magnetics on Silicon an Enabling Technology for Power Supply on Chip’, IEEE Transactions on Power Electronics, vol. 20, no. 3, May 2005, pp585-592.
• N. Wang,, T. O’Donnell, S. Roy, M. Brunet, P. McCloskey, S.C. O’Mathuna, “High Frequency Micro-Machined Power Inductor”, Journal of Magnetism and Magnetic Materials, 2005, vol. 290-291, part 2, April 2005, pp1347-1350.
• S. Prabhakaran, T. O’Donnell, C. Sullivan, M. Brunet, S. Roy, C. O’Mathuna, “Microfabricated Coupled Inductors for Low Voltage, High Current Power Applications”, Journal of Magnetism and Magnetic Materials, vol. 290-291, part 2, April 2005, pp1343-1346.
• O. Chevalerais, T. O’Donnell, S. C. O’Mathuna, “Inductive Telemetry of Sensor Modules”, IEEE Pervasive Computing, vol 4. no. 1, Jan-Mar 2005, pp46-52..
• N. Wang, H. Hauser, T. O’Donnell, M. Brunet, P. McClosley, S.C.O’Mathuna, “Modelling of High frequency Micro-transformers”, IEEE Trans. Mag, vol. 40, no 4. July 2004, pp. 2014-2016.
• N. Wang , T. O'Donnell , H. Hauser , P. McCloskey and S. C. O'Mathuna, “Hysteresis modelling of high-frequency micro-transformers”, Journal of Magnetism and Magnetic Materials, vol. 272-276, Supplement 1, May 2004, pp e1763-e1764.
• M. Ludwig, M. Duffy, T. O'Donnell, P. McCloskey, S.C.O'Mathuna, "PCB Integrated Inductors for Low Power Dc-Dc Converters", IEEE Trans. Power Electronics, vol. 18, no. 4, July 2003, pp.937-945.
• Ludwig, M.; Duffy, M.; O'Donnell, T.; McCloskey, P.; OMathuna, S.C.Magnetics Design study for ultraflat PCB-integrated inductors for low-power conversion applications, , IEEE Transactions on Magnetics,Volume: 39 , Issue: 5 , Sept. 2003 Pages:3193 – 3195.
• M Brunet, T. O'Donnell, L. Baud, N. Wang, J. O'Brien, P. McCloskey, S. C. O'Mathuna. ² Electrical Performance of Micro-Transformers for DC-DC Converter Applications", ", IEEE Transactions on Magnetics, vol 38., no. 5, September 2002.
• M. Brunet, Terence O'Donnell, Joe O'Brien, Paul McCloskey, Seán Cian O Mathuna, "Thick Photoresist Development for the Fabrication of High Aspect Ratio Magnetic Coils". Journal of Micromechanical and Microengineering, vol 12. No. 4, July 2002, pp444-449.
• S. Roy, A. Connell, M. Ludwig, N. Wang, T. O’Donnell, M. Brunet, P. McCloskey, C. ÓMathúna, A. Barman and R.J. Hicken, Pulse reverse plating for integrated magnetics on Si Journal of Magnetism and Magnetic Materials, Volumes 290-291, Part 2, April 2005, Pages 1524-1527
• S. O’Mathuna, P. Byrne, G. Duffy, W. Chen, M. Ludwig, T. O’Donnell, P. McCloskey, M. Duffy, “Packaging and Integration Technologies for Future High Frequency Power Supplies”, IEEE Trans. Industrial Applications, vol. 51, no. 6, Dec 2004.