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The Microelectronics Applications Integration (MAI) Group is researching technology platforms and deployment scenarios that will play a key role in the development of future intelligent or smart systems, combining the areas of electronic system integration, on-chip sensing and actuation, autonomous power scavenging and wireless communications. The research programme is based on functional integration that will enable “system-in-package” or “heterogeneous integration” on silicon.
The Tyndall Institute sees research into optimum materials, technologies and innovative packaging formats as a key enabling platform for future advances in ICT-based products.
Research in this area is being undertaken in the following strategic areas:
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