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JOHN BARTON, BE, MEngSc
Title: Staff Researcher

email: john.barton@tyndall.ie

Phone: +353-21-4904088

BIOGRAPHY:

John Barton received his M Eng Sc degree from UCC in 2006. He joined the Interconnection and Packaging Group of the National Microelectronics Research Centre (now Tyndall National Institute) as a Research Engineer in 1993. From 1993-1996, John worked on the EU funded IBCAR and SUMMIT projects in the assembly, testing and characterisation of high density packaging substrates. From 1996-1999, he was Project Manager for the NMRC on EU funded SIR and STAMPEDE projects. And manager of the groups scanning acoustic microscopy (SAM) facility. From 1999 to date, John has been a Research Scientist, Ambient Electronic Systems (AES) team, MAI Group, Tyndall National Institute/NMRC. In that time he has managed or worked on most of the team’s projects including eCubes, MNT Europe, PATENT-DfMM, MULTIPLEYE, D-Systems, RealProf, ACME, FLINT, SUMMIT, IDEALS, SECOND, LASOL, LAP, CAMS and e-Gadgets, HEA, Devastation, SOCIAL and PLANTS projects. As PI on the Enterprise Ireland funded D-Systems project John has been the leader of the development of the Tyndall Wireless Sensor Mote platform.

 

RESEARCH INTERESTS:

Currently in the Ambient Electronic Systems team where his recent research interests include ambient systems research, wearable computing, high density flexible interconnect, wireless sensor networks and materials research for 3-D packaging.

 

PUBLICATIONS:

Book Chapters

  • J Barton, B Majeed, P McCloskey, KM Razeeb, “Embedded Microelectronic Subsystems”, Chapter in “Augmented Materials and Smart Objects: Building Ambient Intelligence Through Microsystems Technology”. Edited by K. Delaney. Pubs Springer. ISBN10: 0387462635. In Press To be Published Oct 2008

  • J Barton, B O'Flynn, RV Martinez-Catala, S Harte, “Distributed Embedded Sensor and Actuator Platforms”, Chapter in “Augmented Materials and Smart Objects: Building Ambient Intelligence Through Microsystems Technology”. Edited by K. Delaney. Pubs Springer. ISBN10: 0387462635. In Press To be Published Oct 2008

  • John Barton, Dr. Cian Ó Mathúna, Stephen O’Reilly, Tom Healy, Brendan O’Flynn, Stephen Bellis and Kieran Delaney, “Micro and Nano Technology Enabling Ambient Intelligence for P-Health”, Chapter in "Personalised Health: The Integration of Innovative Sensing, Textile, Information & Communication Technologies". Volume 117 Studies in Health Technology and Informatics, Edited by: C.D. Nugent, P.J. McCullagh, E.T. McAdams and A. Lymberis. Pubs IOS Press. December 2005 ISBN: 1-58603-565-7

  • K. Delaney, J.Barton, S. Bellis, B. Majeed, T. Healy, C. O’Mathuna, G. Crean, “Creating Systems for Ambient Intelligence” – chapter in "Silicon: Evolution and Future of a Technology” pubs Springer-Verlag Berlin Heidelberg 2004, eds, Siffert and Krimmel, pp 489-514.

Journals

  • John O’Donoghue, David Sammon, John Herbert, and John Barton, “Managing Data Quality Issues Associated with Body Area Networks”, SUBMITTED to IEEE Journal on Selected Areas in Communications - Special Issue on Wireless and Pervasive Communications in Healthcare
  • Bivragh Majeed, Kafil M. Razeeb, Indrajit Paul, John Barton and Cian O’Mathuna, “Effect of Gold Stud Bump Topology on Reliability of Flip Chip on Flex Interconnects”, IEEE Transactions on Advanced Packaging, Volume 30, Issue 4, Nov. 2007 Page(s):605 – 615
  • Brendan O'Flynn., J Buckley, D. Laffey, J. Barton , S.C. O'Mathuna, "Simulation, Design, Development and Test of Antennas for Wireless Sensor Network Systems", Microelectronics International, Volume 24, Number 2, 2007, pp. 3-6
  • J. Barton, G. Hynes, B. O’Flynn, K. Aherne, A. Norman, A. Morrissey, “25mm sensor–actuator layer: A miniature, highly adaptable interface layer”, Sensors and Actuators A 132 (2006), pp.362–369, November 2006
  • Bivragh Majeed, Kieran Delaney, John Barton, Niall McCarthy, Sean C O’Mathuna and John Alderman, “"Fabrication And Characterisation Of Flexible Substrates For Use In The Development Of Miniaturised Wireless Sensor Network Modules", Journal of Electronic Packaging, Volume 128, Issue 3, pp. 236-245, September 2006
  • Indrajit Paul, Bivragh Majeed, Kafil M.Razeeb, John Barton, S C O'Mathuna, "Statistical Fracture Modelling of Silicon with Varying Thickness", Acta Materialia, Volume 54, Issue 15, Pages 3991-4000 (September 2006)
  • Indrajit Paul, Bivragh Majeed, Kafil M. Razeeb and John Barton, “Characterizing Stress in Ultra-Thin Silicon Wafers”, Applied Physics Letters 89, 073506 (2006)
  • Bivragh Majeed, Kafil M. Razeeb, Indrajit Paul, John Barton and Cian O’Mathuna, “Microstructural,Mechanical, Fractural and Electrical Characterisation of Thinned and Singulated Silicon Test Die” J. Micromech. Microeng. Volume 16, Number 8, August 2006 pp. 1519–1529
  • Stephen J. Bellis, Kieran Delaney, Brendan O’Flynn, John Barton, Kafil M. Razeeb, Cian O’Mathuna, “Development of Wireless Sensor Networks for Ambient Systems”, Computer Communications - Special Issue on Wireless Sensor Networks and Applications, Volume 28, Issue 13, Pages 1531-1544.
  • J. Barton, D Vanderstraeten, Gust Schols, T Howard, P Groeneveld, ‘STAMPEDE - "Standard Techniques for Acoustic Microscopy For Plastic Encapsulated Devices", The International Journal of Microcircuits and Electronic Packaging, Volume 25, Number 2, 2nd Quarter, 2002, pp 223-232
  • M.Lozano, J.Santander, E.Cabruja, A.Collado, M.Ullan, E.Lora-Tamayo, R.Doyle, G.McCarthy, J.Barton, O.Slattery "Extensive Electrical and Thermal Characterization of an MCM-D Technology" IEEE Transactions on Components and Packaging Technologies, Vol.25, No.1, March 2002, pp 112-119
  • J.Barton, T.Randles, S. Hearne, J.Barrett, P.V.Kelly, G.Crean, P.Siffert, JM Koebel; “Scanning Acoustic Microscopy and SIMS Investigation of CdTe Detectors“, Nuclear Instruments & Methods in Physics Research, Section A – Nuclear Inst. and Methods in Physics Research, A , Jan, 2001, volume 458 issue 1-2, pp 431-436
  • J. Barton, G. McCarthy, R. Doyle, K. Delaney, E. Cabruja, M. Lozano, A. Collado, J. Santander, “Reliability Evaluation of Silicon-on-Silicon MCM-D Package”, Microelectronics Reliability, June 2001, Volume 41 issue6, pp 887-899
  • J. Barton, T. Randles, D. Vanderstraeten, G. Schols, T. Howard, P. Groenveld, “STAMPEDE – Standard Techniques for acoustic microscopy of plastic encapsulated devices” Acoustical Imaging, Vol 25. pp 189-197 Halliwell M, Wells PNT, eds, New York: Plenum Press, 2000
  • J. Barton, T. Compagno, J. Barrett, “Scanning Acoustic Microscopy case studies of microelectronic packaging”, Acoustical Imaging, Vol 25. pp 261-273 Halliwell M, Wells PNT, eds, New York: Plenum Press, 2000
  • M. Lozano, G.McCarthy, J.Barton, R.Doyle, J.Santander, E.Cabruja, C.Perello, M.Ullan, E.Lora-Tomayo 'Test Structures for MCM-D Technology Characterisation' IEEE Transactions on Semiconductor Manufacturing, May 1999, Volume 12, Number 2.
  • K. Delaney, J. Barrett, J. Barton, R. Doyle, “Characterisation and Performance Prediction for Integral Capacitors in Low Temperature Co-Fired Ceramic Technology”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 22, No. 1, February 1999, pp. 68-77.
  • K. Delaney, J. Barrett, J. Barton, R. Doyle, “Characterisation and Performance Prediction for Integral Resistors in Low Temperature Co-Fired Ceramic Technology”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 22, No. 1, February 1999, pp. 78-75.

Conferences

  • Vladimir Yurchenko, John Anthony Murphy, John Barton, Jaap Verheggen, Ken Rodgers, "Dual-Layer Frequency-Selective Grid Polarizers on Thin-Film Substrates for THz Applications", ACCEPTED for 38th European Microwave Conference 2008, Amsterdam, 28-31 October 2008

  • Brendan O’Flynn, J Barton, A Gonzalez, J Buckley, S C O’Mathuna, “Sugarcube WIMU – The implementation of a highly miniaturized Wireless Inertial Measurement Unit”, Proc. XXXI International Conference of IMAPS Poland Chapter Rzeszów - Krasiczyn, 23 - 26 September 2007, pp. 491-494

  • P. Angove, Brendan O’Flynn, J. Barton, A. Gonzalez, Cian O’Mathuna, John O’Donoghue, S.J. Min, J. Herbert, "Wireless ECG – A Biomonitor Implementation for E-Health”, Proc. 4th pHealth Conference: Personalised healthcare : Micro-nano-bio systems and medical information networks enabling quality and efficient healthcare, Chalkidiki, Thessaloniki, Greece on June 20-22, 2007

  • J Barton, A Gonzalez, J Buckley, B O’Flynn, S C O’Mathuna, “Design, Fabrication and Testing of Miniaturised Wireless Inertial Measurement Units”, Proc. ECTC 2007, Reno, Nevada, USA, May 29 -June 1, 2007, pp1143-1148

  • K. Delaney, S. Dobson and J. Barton, "Augmented materials: micro- and nano-sensing”, Proceedings of the Sensors and Systems Symposium at the NSTI Nanotechnology Conference (Nanotech 2007), Santa Clara, CA. May 20 -24, 2007
  • John Barton, John Buckley ,Brendan O'Flynn, Jonathan Benson, Tony O'Donovan, Utz Roedig, Cormac Sreenan, “The D-Systems Project - Wireless Sensor Networks for Car Park Management”, Proc. 2007 IEEE 65th Vehicular Technology Conference, VTC2007, 23-25 April, 2007, Dublin, Ireland, pp 170-173
  • Frank Murphy, Brendan O’ Flynn, Dennis Laffey, John Buckley and John Barton, “Development of a wireless sensor network for autonomous agents capable of repairment of point defects in water tanks”, Proc. 4th EWSN 2007, Delft University of Technology, Delft, The Netherlands, January 29-31, 2007
  • Brendan O’Flynn, Frank Murphy, John Buckley, Dennis Laffey and John Barton, “Underwater Robotic Collaborative Agent Development”, Information Technology & Telecommunications Conference 2006, Institute of Technology, Carlow, October 25-26, 2006. Proc pp 219-220
  • Dennis Laffey, Daniel Rogoz, Brendan O’Flynn, Fergus O’Reilly, John Buckley& John Barton, “Containers – Innovative Low Cost Solutions For Cargo Tracking” Information Technology & Telecommunications Conference 2006, Institute Of Technology, Carlow, October 25-26, 2006. Proc Pp 187-188
  • Mathieu Hautefeuille, Conor O’Mahony, Brendan O’Flynn, John Barton, Frank Peters “A Wireless MEMS Sensor System for Telecommunications Reliability Monitoring”, Proc. 30th International IMAPS Poland Conference, KraKow, Poland, 24 - 27 September 2006, pp 307-310
  • O'Flynn B., Martinez R., Barton J., O'Mathuna S.C., Barrett J., "Development and Characterisation of a low cost ISM band RF Multi Chip Module with Embedded Inductors", Proc. 30th International IMAPS Poland Conference, KraKow, Poland, 24 - 27 September 2006, pp 353-356.
  • O'Flynn, B., Buckley J., Laffey D., Barton J., O'Mathuna S.C., "Simulation, Design, Development and Test of Antennas for Wireless Sensor Network Systems”, Proc 30th International IMAPS Poland Conference, KraKow, Poland, 24 - 27 September 2006, pp 517-520 – Awarded Best Poster
  • Brendan O’Flynn, P. Angove, J. Barton, A. Gonzalez, J. O’Donoghue, J. Herbert, “Wireless Biomonitor for Ambient Assisted Living”, Proceedings International Conference on Signals and Electronic Systems, ICSES'06 , Lodz, Poland, Sept 17-20, 2006, pp. 257-260
  • Brendan O’Flynn, Frank Murphy, John Buckley, Dennis Laffey, John Barton, Hani Hagras, Martin Colley, Anthony Pounds-Cornish, “SOCIAL –Collaborative Agent Development”, Proceedings International Conference on Signals and Electronic Systems, ICSES'06, Lodz, Poland, Sept 17-20, 2006, pp. 467-470.
  • Conor O’Mahony, Mathieu Hautefeuille, Brendan O’Flynn, John Barton, Pamela Crookston, Paul Lambkin, Frank Peters " Integrated Microsensors For Wireless Monitoring Applications”, Proc. MMM 2006, The 17th Micromechanics Europe Workshop, September 3-5, 2006, Southampton, UK, pp. 133-136.
  • Bivragh Majeed, Jean-Baptiste Van Sinte Jans, Orla Slattery, John Barton, Sean C O’Mathuna, Matt Kelley, Ajay P. Malshe, “Thermo-Mechanical Modelling and Thermal Performance Characterisation of a 3-D Folded Flex Module”, Proceedings ECTC 2006, Sheraton San Diego, San Diego, California, May 30- June 2, 2006, pp728-733.
  • John Buckley, Kevin Aherne, Brendan O’Flynn, John Barton, Bivragh Majeed, Cian O'Mathuna, “Antenna Performance Measurements Using Wireless Sensor Networks” Proceedings ECTC 2006, Sheraton San Diego, San Diego, California, May 30- June 2, 2006, pp1652-1657.
  • Kafil M. Razeeb, Lorraine Nagle,John Barton, Paul Tassie, Brendan O’Flynn, James Rohan and Cian O’Mathuna, “3D Interconnection by FIB Assisted Pt Deposition and Electroless Nickel Deposition on the Sides and Edges of an I-Seed”, Proceedings ECTC 2006, Sheraton San Diego, San Diego, California, May 30- June 2, 2006, pp1308-1311.
  • Brendan O’Flynn, A. Lynch, Kevin Aherne, P. Angove, Sean Harte, John Barton, Sean C.O’Mathuna, Fiona Regan, Dermot Diamond, “The Tyndall Mote: Enabling Wireless Research and Practical Sensor Application Development”, Adjunct Proceedings of the 4th International Conference on Pervasive Computing, Pervasive 2006, Dublin, May 07-10, 2006, pp. 21-26.
  • John Barton, Brendan O’Flynn, Kevin Aherne, Anthony Morrissey, John O’Sullivan, Alan Cassells, Nikos Drossos, Christos Goumopoulos, Fiona Tooke, Peter Whitbread-Abrutat, “PLANTS DEMO - Enabling Mixed Societies of Communicating Plants and Artefacts”, Adjunct Proceedings of the 4th International Conference on Pervasive Computing, Pervasive 2006, Dublin, May 07-10, 2007, pp. 139-142.
  • J Barton, A Lynch, B O’Flynn, K Aherne, C Nester, J Y Goulermas, D Howard, F Thorsteinsson, M Pepper, R Fulford, D Shklarski, I Murray, J Buurke, H Bussman, P.J. Slycke, “A System For Real World Monitoring Of Prostheses And Footwear”, Proc. 3rd European Medical and Biological Engineering Conference EMBEC'05, November 20-25, 2005, Prague, Czech Republic, P. 1826
  • John Buckley, Brendan O'Flynn, Bivragh Majeed, Kevin Aherne, John Barton, S C O'Mathuna, “Development of Miniaturised Antennas for Wireless Sensor Networks”, Information Technology & Telecommunications Conference 2005, 26th-27th October 2005, National Maritime College, Cork Institute of Technology, Ireland Proc. pp.249-251.
  • Philip Angove, Brendan O’Flynn, Julie Donnelly and John Barton, “National Access Program (NAP) wireless sensor modules, enabling research innovation”, Information Technology & Telecommunications Conference 2005, 26th-27th October 2005, National Maritime College, Cork Institute of Technology, Ireland.
  • Frank Murphy, Brendan O’ Flynn, Dennis Laffey, Anne-Marie McCarthy, Stephen Bellis, John Barton, S.C.O Mathuna, “Implementation of Wireless Communications Systems for Underwater Agents”, Information Technology & Telecommunications Conference 2005, 26th-27th October 2005, National Maritime College, Cork Institute of Technology, Ireland, Proc. pp.257-259.
  • Andrew Lynch, Suleiman Kharmeh, John Barton, Brendan O’Flynn, Philip Angove, S C O Mathuna, “Design and Characterisation of a Wireless Inertial Measurement Unit for Integration to a Wireless Network Scenario”, Information Technology & Telecommunications Conference 2005, 26th-27th October 2005, National Maritime College, Cork Institute of Technology, Ireland, Proc. pp.245-247.
  • John Barton, Brendan O’Flynn, Philip Angove, Adriana Gonzalez, John O’Donoghue and John Herbert, “Wireless Sensor Networks and Pervasive Patient Monitoring”, Information Technology & Telecommunications Conference 2005, 26th-27th October 2005, National Maritime College, Cork Institute of Technology, Ireland, Proc. pp.309-310
  • Kieran Delaney, Simon Dobson, Kafil M. Razeeb, John Barton, “Creating Disappearing Computers: Using Augmented Materials to Build Collaborative Augmented Artifacts”, Information Technology & Telecommunications Conference 2005, 26th-27th October 2005, National Maritime College, Cork Institute of Technology, Ireland, Proc. pp.243-244.
  • A Lynch, J Barton, B O’Flynn, F Murphy, S C O’Mathuna, P Repetto, R Finizio, C Carvignese; L Liotti, “Design and Fabrication of Miniaturised Inertial Measurement Units for Automotive Heads Up Displays”, Proc. 29th IMAPS – POLAND CHAPTER CONF. 2005, September 19 - 22, 2005, pp. 271-274
  • G. Hynes , J. Barton, B. O’Flynn, K. Aherne, A. Norman, K. Twomey , A. Morrissey, “25MM Sensor-Actuator Layer: A Miniature, Highly Adaptable Interface Layer For The Plants Project”, EUROSENSORS XIX, 11-14 September 2005, Barcelona, Spain, TC18
  • Bivragh Majeed, Andrew Lynch, John Barton, Brendan O’ Flynn, Cian O’Mathuna, Kieran Delaney, "3-D Packaging of MEMS Sensors for Development of Miniaturised Inertial Measurement Unit", IMAPS Nordic Conference 2005, September 11 - 14, Tønsberg, Norway, pp 178-182.
  • A Lynch, B Majeed, B O’Flynn, J Barton, F Murphy, K Delaney, S C O’Mathuna, “A wireless inertial measurement system (WIMS) for an interactive dance environment”, Sensors & their Applications XIII, 6 - 8 September 2005, Greenwich, Kent, England, pp 95-100.
  • John Barton, Brendan O’Flynn, Stephen Bellis, Andrew Lynch, Micheal Morris, Sean Cian O’Mathuna, "A Miniaturised Modular Platform For Wireless Sensor Networks", Proc. 2005 European Conference on Circuit Theory and Design, 29 Aug-1 Sep, 2005, Cork, Ireland, pp 35-38.
  • Bivragh Majeed, Kieran Delaney, John Barton, Stephen Bellis, Sean C O’Mathuna, “Material Characterisation And Process Development For Miniaturised Wireless Sensor Network Module”, IEEE Ph.D Research in Microelectronics and Electronics (PRIME) Conference, 25-27 July 2005, (EPFL), Lausanne, Switzerland
  • J Barton, A Lynch, S Bellis, B O’Flynn, F Murphy, K Delaney, S C O’Mathuna, P Repetto, R Finizio, C Carvignese; L Liotti, “Miniaturised Inertial Measurement Units (IMU) for Wireless Sensor Networks and Novel Display Interfaces”, Proc. ECTC 2005, 55th Electronic Components & Technology Conf., Wyndham Palace Resort And Spa, Lake Buena Vista, Florida, May 31- June 3, 2005, pp 1402-1406
  • B.O’Flynn, A.Barroso, S.Bellis, J.Benson, U.Roedig, K.Delaney, J. Barton, C.Sreenan, C.O’Mathuna, “The Development of a Novel Miniaturized modular Platform for Wireless Sensor Networks”, Proc. The Fourth International Conference on Information Processing in Sensor Networks (IPSN'05), UCLA, Los Angeles, California, USA, April 24-27, 2005, pp 370-375.
  • C Gallagher, P J Hughes, P Tassie, K Rodgers, J. Barton, J Justice, D P. Casey, “Solder Jet Technology for Advanced Packaging”, Opto Ireland 2005, 4–6 April 2005, Royal Dublin Society, Dublin, Ireland
  • John Barton, Bivragh Majeed, , Kieran Delaney, Stephen Bellis, Kafil M. Razeeb, Brendan O'Flynn, Bivragh Majeed, Andrew Lynch, Sean Cian O'Mathuna, "3-D Microsensor Modules for Future Intelligent Environments”, Proc. International Conference and Exhibition on Device Packaging, Scottsdale, AZ USA, March 13 - 16, 2005
  • J Barton, C Nester, J Y Goulermas, D Howard, F Thorsteinsson, M Pepper, R Fulford, D Shklarski, I Murray, J Buurke, H Bussman, P.J. Slycke, “A System For Real World Monitoring Of Prostheses And Footwear”, The Third IASTED International Conference on Biomedical Engineering, BioMED 2005, February 16-18, 2005, Innsbruck, Austria, pp 619-623.
  • J Barton, A Lynch, S Bellis, B O’Flynn, K M Razeeb, K Delaney, S C O’Mathuna, “An Inertial Measurement Unit (IMU) for an Autonomous Wireless Sensor Network”, Proc. 6th Electronics Packaging Technology Conference (EPTC 2004), December 8-10, 2004, Singapore, pp. 586-589
  • B. Majeed, K. Delaney, J. Barton, K. Razeeb, N. Maccarthy, C. O’Mathuna, “The Development of a Test Vehicle for Applications in Ambient Electronic Systems using very Thin Flexible Substrate”, Proc. 6th Electronics Packaging Technology Conference (EPTC 2004), December 8-10, 2004, Singapore, pp. 369-374
  • Andre Barroso, Jonathan Benson, Tina Murphy, Utz Roedig, Cormac Sreenan, John Barton, Stephen Bellis, Brendan O'Flynn, and Kieran Delaney. Demo Abstract: The DSYS25 Sensor Platform. Proceedings of the Second ACM Conference on Embedded Networked Sensor Systems (SENSYS2004), Baltimore, USA, 3-5, November 2004.
  • Andre Barroso, Jonathan Benson, Tina Murphy, Utz Roedig, Cormac Sreenan, John Barton, Stephen Bellis, Brendan O'Flynn, and Kieran Delaney. Demo Abstract: “The DSYS25 Sensor Platform.” Proceedings of the Fourth IT&T Conference, Limerick, Ireland, 20-21 October 2004
  • A Lynch, J Barton, S Bellis, B O’Flynn, K Mahmood, B Majeed, J O’Mahony, K Delaney, S C O’Mathuna, “3-D Integration for Augmented Human-Computer Interaction (HCI)”, 1st Intel Ireland Research Conference, 14-15 September, 2004, Leixlip, Ireland
  • J Barton, B O’Flynn, F Murphy, A Lynch, C Nester, M Pepper, R Fulford, D Shklarski, P.J. Slycke, “Design and Fabrication of a Sensors Interface Unit for Real World Monitoring Of Prostheses And Footwear”, Proc. XXVIII International Conference of IMAPS, 26-29 September, 2004, Poland Chapter Wroclaw, pp 159-162
  • Stephen Bellis, David Murphy, David Harty, John Barton, Brendan O’Flynn, Kieran Delaney, Cian O’Mathuna, Nicholas Drossos, Achilles Kameas, Irene Mavrommatti, Anthony Pounds-Cornish, Arran Holmes, Martin Colley, Vic Callaghan, “Medical eGadgets” Ubicomp 2004, Sept 7-10, 2004, Nottingham, England
  • Kafil M. Razeeb, Stephen Bellis, Brendan O’Flynn, John Barton, Kieran Delaney and Cian O’Mathuna, ‘A Hybrid Network of Autonomous Sensor Nodes’, EUSAI 2004, 8-10 November, 2004, Eindhoven, the Netherlands.
  • C Nester, D Howard, F Thorsteinsson, M Pepper, R Fulford, D Shklarski, I Murray, J Barton, M Nederhand, H Bussman, P.J. Slycke, M Carter, “Real World Monitoring of prostheses and footwear (Real-Prof)”, The 11th World Congress of the International Society for Prosthetics & Orthotics, August 1-6, 2004, Hong Kong
  • C Nester, D Howard, F Thorsteinsson, M Pepper, R Fulford, D Shklarski, I Murray, J Barton, J Buurke, H Bussman, P.J. Slycke, “Real World Monitoring of prostheses and footwear (Real-Prof)”, Orthopaedie & Rehab Technik, World Congress for Prosthetics, Orthotics and Rehabilitation Technology, 19-22 May, 2004, Leipzig, Germany
  • J Barton, B Majeed, K Dwane, K Delaney, S Bellis, K Rodgers, S C O’Mathuna “Development and Characterisation of Ultra Thin Autonomous Modules for Ambient System Applications Using 3D Packaging Techniques”, 54th Electronic Components and Technology Conference ECTC 2004, June 1-4, 2004 Las Vegas, USA, pp 635-641
  • T Healy, J Donnelly, B O’Neill, K Delaney, K Dwane, J Barton, J Alderman, A Mathewson “Innovative Packaging Techniques for Wearable Applications using Flexible Silicon Fibres, 54th Electronic Components and Technology Conference ECTC 2004, June 1-4, 2003 Las Vegas, USA, pp. 1216-1219.
  • J Barton, C Nester, D Howard, F Thorsteinsson, M Pepper, R Fulford, D Shklarski, I Murray, J Buurke, H Bussman, P.J. Slycke, “Real World Monitoring Of Prostheses And Footwear (Real-Prof)”,17th international EURASIP conference BIOSIGNAL 2004, June 23-25, 2004, Brno, Czech Republic
  • J Barton, K Delaney, S Bellis, S C O’Mathuna, J A. Paradiso, A Benbasat “Development of Distributed Sensing Systems of Autonomous Micro-Modules” Proc. 53rd Electronic Components and Technology Conference ECTC 2003 pp 1112-1118, May 27-30, 2003 New Orleans, USA
  • K Delaney, S Bellis, J Barton, A Kameas, I Mavrommati, M Colley, A Pounds-Cornish, “Unobtrusive Transducer Augmentation of Everyday Objects for Systems with Dynamic Interactivity” Sensors & their Applications XII, September 2-4, 2003, Limerick, Ireland
  • K. Delaney, J Barton, S Bellis, S C O’Mathuna “Systems Integration and Packaging Requirements for Ambient Intelligence” Proc. 40th IMAPS Nordic Conference pp 13-20, September 21-24 at Helsinki University of Technology Campus, Espoo, Finland.
  • B. Majeed, K. Delaney, J. Barton, J. O’Brien, A. Kelleher, S C O’Mathuna “Implementing Ultra Thin Autonomous Modules for Ambient Systems Applications using 3-D Packaging Techniques” Proc. 40th IMAPS Nordic Conference pp 27-34, September 21-24 at Helsinki University of Technology Campus, Espoo, Finland.
  • J Barton, K Delaney, S C O’Mathuna, J A. Paradiso “Miniaturised Modular Wireless Sensor Networks” UbiComp 2002, September 29 - October 1, 2002, Göteborg, Sweden.
  • J Barton, K Delaney, N O’Mahoney, S C O’Mathuna, J A. Paradiso, A Benbasat “Functional Integration for Embedded Intelligence” ICEWES 2002, December 10 - December 11, Cottbus, Germany.
  • Kieran Delaney, John Barton, “The Challenge of Globally Embedding Functional Electronics into Everyday Artefacts”, Conference on Smart Packaging – Materials, Technologies, and Market Needs, November 14, 2001, Institute of Materials, London, UK.
  • John Barton, Tony Compagno and S.C O’Mathuna, “Failure analysis of advanced packaging technologies using scanning acoustic microscopy”, International Symposium on Microelectronics and MEMS Technologies, 30 May-1 June 2001, Edinburgh, Scotland
  • T. Howard, J. Barton, T. Randles, D. Vanderstraeten, G. Schols, P. Groeneveld, "SAM : Standard Operation and Calibration", FACTS 2000 Conference, June 27-28, 2000, Farnborough, United Kingdom.
  • J. Barton, T. Randles, D. Vanderstraeten, G. Schols, T. Howard, P. Groenveld, “STAMPEDE – Standard Techniques for acoustic microscopy of plastic encapsulated devices”, 25th International Acoustical Imaging Symposium, 19-22 March 2000, Bristol UK
  • J. Barton, T. Compagno, J. Barrett, “Scanning Acoustic Microscopy case studies of microelectronic packaging”, 25th International Acoustical Imaging Symposium, 19-22 March 2000, Bristol UK
  • J. Barton, T. Randles, D. Vanderstraeten, G. Schols, T. Howard, P. Groenveld, “STAMPEDE – Standard Techniques for acoustic microscopy of plastic encapsulated devices”, 1st Advancements in Ultrasonic Analysis Symposium, April 4-6, 2000, Old Town Alexandria, Virginia, USA.
  • J. Barton, T. Compagno, K. Delaney, S. O”Reilly, M. McEnery, S.C. O”Mathuna, J. Barrett, “Scanning Acoustic Microscopy of Novel Technologies”, 1st Advancements in Ultrasonic Analysis Symposium, April 4-6, 2000, Old Town Alexandria, Virginia, USA
  • J. Barton, G. McCarthy, R. Doyle, J. Barrett, “Reliability Evaluation of Silicon-on-Silicon MCM-D”, Proceedings of IMAPS-Europe Prague 2000, 18-20 June 2000, Prague, pp 281-286
  • J. Barton, R. Murphy, R. Doyle, K. Delaney, “Popcorn Testing of Liquid Encapsulants”, Proceedings of the 37th IMAPS Nordic Conference, 10-13 September 2000, Helsingor, Denmark, pp.101-108
  • K. Delaney, J. Barrett, J. Barton, R. Doyle, “Characterisation of the electrical performance of Buried Capacitors and Resistors in Low Temperature Co-fired (LTCC) Ceramic”, Proceedings of the 48th Electronic Components & Technology Conference, May 25-28, 1998, Seattle, pp 900-908.

Workshops/Symposia

  • Mathieu Hautefeuille, Conor O’Mahony, Brendan O’Flynn, John Barton, Frank Peters, “Implementation of a MEMS sensor system for reliability monitoring”, 2nd Workshop on Wireless Sensor Networks Research in Ireland  (WiSen 2007), June 11, 2007, Dublin, Ireland

  • John Barton, John Buckley ,Brendan O'Flynn, Jonathan Benson, Tony O'Donovan, Utz Roedig, Cormac Sreenan, “The D-Systems Project - Wireless Sensor Networks for Car Park Management”, 2nd Workshop on Wireless Sensor Networks Research in Ireland  (WiSen 2007), June 11, 2007, Dublin, Ireland

  • P. Angove, Brendan O’Flynn, J. Barton, A. Gonzalez, Cian O’Mathuna, John O’Donoghue, S.J. Min, J. Herbert, “Wireless ECG – A Biomonitor Implementation for E-Health”, 2nd Workshop on Wireless Sensor Networks Research in Ireland  (WiSen 2007), June 11, 2007, Dublin, Ireland

  • B. O’Flynn, G Torre, M. Fernstrom, T. Winkler, A. Lynch, J. Barton, P.Angove, S. C O’Mathuna, “Celeritas – A Wearable Sensor System for Interactive Digital Dance Theatre”, Proc. 4th International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2007), Aachen, Germany, March 26-28, 2007, pp 161-165

  • John Barton, "Failure Analysis for Package-related Yield & Reliability Enhancement", NMI Failure Analysis, Characterisation and Reliability Network Meeting - “Packaging”, March 29th 2007, Crumlin, South Wales
  • John Barton, Brendan O'Flynn and Cian O Mathuna, “Ambient Electronics Systems Research at the Tyndall National Institut” US-Ireland R&D Partnership Sensors Workshop, Feb 20th, Dublin, Ireland
  • Cian O Mathuna, Brendan O'Flynn, John Barton, "Wireless Sensor Systems and Technololgies for Applications in Ambient Intelligence”, 10th European System Packaging Workshop, Como, Italy, January 29 – January 31, 2007
  • Indrajit Paul, Bivragh Majeed, Kafil M.Razeeb, John Barton, S C O'Mathuna, “Reliability of thin silicon dies for chip-on-flex (COF) packages”, MICROPACKAGING DAYS 2006, STUniversity, Fuveau, France - 23 November 2006
  • Jonathan Benson, Tony O'Donovan, Padraig O'Sullivan, Utz Roedig, Cormac Sreenan, John Barton, Aoife Murphy ,Brendan O'Flynn, "Car-Park Management using Wireless Sensor Networks”, Proc. First International Workshop on Practical Issues in Building Sensor Network Applications (SenseApp 2006), 14-17th November 2006,Tampa, Florida, USA, pp 588-596
  • Bivragh Majeed, Indrajit Paul, Kafil M Razeeb, John Barton, Sean C O’Mathuna, “An Investigation Into Mechanical Properties and Long Term Reliability Prediction of Thin Silicon Dies” Forum 2005 'be-flexible' 6th International Workshop on Thin Semiconductor Devices”, November 22-23, 2005, Munich, Germany
  • Kafil. M. Razeeb, Brendan O’Flynn, John Barton and Cian O’Mathuna, “Development Of Sensor Board, Sensor Interface Layer And Power Layer For Mica2 Mote”, GoodFood Workshop, 14-15 March 2005, Montreaux, Switzerland
  • G Hynes, J Barton, S Bellis, B O’Flynn, K. M. Razeeb, K Delaney, A M Barroso, S C O’Mathuna, “Wireless Sensor Network Hardware for Environmental Applications”, TinyOS Technology Exchange, University of California Berkeley, 11th February 2005
  • K. M. Razeeb, Stephen Bellis, Brendan O’Flynn, John Barton, Kieran Delaney and Cian O’Mathuna, ‘Development of Autonomous Network Sensor Nodes for Wine Chain Monitoring’, GoodFood Workshop, 16-18 June, 2004 Cork, Ireland.
  • S Bellis, K Delaney, J Barton, K Razeeb, B O’Flynn, B Majeed, “Development of Wireless Sensor Networks for Ambient Systems”, Invited Talk at Dagstuhl Seminar 04122 on Wireless Sensor Networks and Applications, Dagstuhl, Germany, 14-19 March 2004
  • Paul McCloskey, Kieran Delaney, John Barton, Razeeb Kafil Mahmood, Cian O’Mathuna, Gerald Duffy “From RFID to Smart Dust, a perception of future applications”, Smart Wireless Tags Workshop, 20 April 04, Brussels
  • B.Majeed, K. Delaney, J. Barton, N. MacCarthy, C. O’Mathuna, “The Development Of A Test Vehicle For Applications In Ambient Electronic Systems Using Very Thin Flex”, The Eleventh Meeting of the Symposium on Polymers for Microelectronics Winterthur , May 5-7, 2004, Wilmington, Delaware USA
  • B.Majeed, K. Delaney, J. Barton, C. O’Mathuna, “Development And Thermo-Mechanical Characterisation Of 3D Folded Flex Module Used As A Technological Platform For The Realisation Of I-Seed”, 3rd European Microelectronics and Packaging Symposium, 16th to 18th June 2004, Prague Czech Republic
  • A. Norman, K. Delaney, J. Barton, S. Bellis, K. Twomey, A. Cassells, S. Rafferty, “Scaleable systems for monitoring signalling and response mechanisms in plants.” UCC BioResearch Day, September 3rd, 2003
  • Cian O Mathuna, Anthony Morrissey, Padraig Hughes, Orla Slattery, John Barton, Gareth Redmond, John Alderman, Kieran Delaney, “Microsystems Packaging and Integration”, IEEE European Systems Packaging Workshop, Barcelona, January 22-24, 2001.
  • D. Vanderstraeten, J. Barton, T. Randles, G. Schols, T. Howard, P. Groenveld, “ Defective & Delaminated IC’s: Do we need universal transport guidelines?” 2000 European VLSI Packaging and Microsystem Packaging Techniques and Manufacturing Technologies Workshop, 8-9 May 2000, Cork, Ireland.
  • G. McCarthy, J. Barton, R. Doyle, J. Barrett, “Reliability Evaluation of Silicon-on-Silicon MCM-D”, 2000 European VLSI Packaging and Microsystem Packaging Techniques and Manufacturing Technologies Workshop, 8-9 May 2000, Cork, Ireland.
  • J. Barton, T. Compagno, K. Delaney, S. O”Reilly, M. McEnery, S.C. O”Mathuna, J. Barrett, “Scanning Acoustic Microscopy of Novel Technologies”, 2000 European VLSI Packaging and Microsystem Packaging Techniques and Manufacturing Technologies Workshop, 8-9 May 2000, Cork, Ireland.
  • J. Barton, T. Randles, D. Vanderstraeten, G. Schols, T. Howard, P. Groenveld, “STAMPEDE – Standard Techniques for acoustic microscopy of plastic encapsulated devices”, 2000 European VLSI Packaging and Microsystem Packaging Techniques and Manufacturing Technologies Workshop, 8-9 May 2000, Cork, Ireland.
  • D. Vanderstraeten, J. Barton, T. Randles, G. Schols, T. Howard, “A Simple and Fast Regular Checker Tool for Scanning Acoustic Microscopes”, 7th Automotive Electronics Reliability Workshop, Oct 24-26, 2000, Ann Arbor, Michigan, USA
  • J. Barton “ Effect of Temperature and Humidity on Surface Insulation Resistance values”, 1st SIR Workshop, Berlin, March 8, 2000
  • J. Barton, T.Randles, S. Hearne, J.Barrett, P.V.Kelly, G.Crean, P.Siffert, JM Koebel; “Acoustic Microscopy Investigation of Surface & Interface of CdTe Detectors“; The 11th International Workshop on Room Temperature Semiconductor X- and Gamma-Ray Detectors and Associated Electronics Oct 11-15, 1999 - Vienna, Austria
  • R. Doyle, J. Barton, K. Delaney, J. Barrett, J. P. Bertinet, E. Polze, “Buried Passive Component Realisation In Low Temperature Cofired Ceramic For MCM-C Substrate Applications”, Proc. NATO Advanced Research Workshop, Budapest, May 18-20, 1995.
  • J. Barrett, J. Barton, K. Delaney, R. Doyle, J. P. Bertinet, E. Polzer, "Development of a Test Program to Evaluate Low Temperature Cofired Ceramic MCMs Incorporating Buried Capacitor and Resistor Components", Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies, Windsor, 8 - 10 June, 1994

Magazines

  • J. Barton, R. Murphy, R. Doyle, K. Delaney, “Popcorn Testing of Liquid Encapsulants”, Advancing Microelectronics, Jan/Feb 2001, volume 28, no. 1, pp.36-40
  • J. Barton, “Scanning Acoustic Microscopy”, Advanced Manufacturing Technology, Vol. 13, No 1, Feb 2000

 

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