Title: Research Assisstant

Email : paul.tassie@tyndall.ie

Phone : +353 21 4094299

Fax : +353 21 4270271

BIOGRAPHY

Paul Tassie is from Cork, and obtained a Diploma in Social Studies at UCC 1990-1992, a Technicians Certificate in Measurement and Control at CIT 1993-1995, and a BA (Arts) at UCC 1995-2003. He has worked at Tyndall (formerly NMRC) for over 22 years. As Engineering Technician he has built up considerable Silicon Fabrication Process expertise, as well as Scanning Electron Microscopy, Field Emission Microscopy including X-Ray Element Analysis expertise. His eventual area of process specialization has been Sub-Micron Photolithographic Process Development at the NMRC’s Silicon Fabrication Laboratory. Latterly at NMRC he moved into the area of Interconnect & Packaging. Here he was instrumental in the development of enhancing the I&P Groups Wire-Bond Interconnect, SMT, Plastic Packaging, and Ceramic Packaging capabilities. He was promoted to Research Assistant and currently works on all aspects of support to the MAI Group.

RESEARCH INTERESTS

His current interests include Optimization of Process Capabilities in the AES Teams’ Through Wafer Via, Etch, Plating, Bonding and Mechanical/Environmental Test capabilities.

PUBLICATIONS:

Kafil M. Razeeb, Lorraine Nagle,John Barton, Paul Tassie, Brendan O’Flynn, James Rohan and Cian O’Mathuna, “3D Interconnection by FIB Assisted Pt Deposition and Electroless Nickel Deposition on the Sides and Edges of an I-Seed”, Proceedings ECTC 2006, Sheraton San Diego, San Diego, California, May 30- June 2, 2006, pp1308-1311.

C Gallagher, P J Hughes, P Tassie, K Rodgers, J. Barton, J Justice, D P. Casey, “Solder Jet Technology for Advanced Packaging”, Opto Ireland 2005, 4–6 April 2005. Royal Dublin Society, Dublin, Ireland