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 Packaging
of semiconductor power electronic device is a challenge due to the
progressive increase in the power level of operating devices. In the
near future, the power level will rise to about 200W, or about an
effective power density of 500 Win-2. In high-power
electronics module packages, the heat generated by the power device is
transferred to the ambient environment by attaching a heat spreader to
the semiconductor package. The heat spreader is attached to the chip
using a thermal interface material (TIM). It has been found that the TIM
contributes ~50% to the thermal impedance of a complete package. Proper
selection of TIM can be crucial for the device efficiency; and instead
of having a big heat sink with sophisticated cooling technique; it is
better to invest on the interface material.
Commercially available thermal interface material (TIM) has thermal
conductivity in the range of 10-30 Wm-1K-1. Carbon
nanotubes (CNT) based thermal interface materials is expected to be have
better thermal conductivity. This is due to the high thermal
conductivity of CNT, which is in the range of 3000 Wm-1K-1.
The Heterogeneous System Integration (HIS) group in Tyndall National
Institute is actively involved in researching novel thermal interface
materials. The SEM image shown above is the metal-polymer composites
fabricated in Tyndall and corresponding graph is showing measured
thermal impedance of two composite TIMs (Type 1 and Type 2) at different
pressure. In this activity, Tyndall is working on the fabrication and
characterisation of thermal interface material systems using different
types of nanotubes and nanowires as filler material.
Relevant Projects:
NTIM:
Nanotubes for Thermal Interface Materials (Enterprise
Ireland Industry Led Research Programme for
Power Electronics
Industry group) in collaboration with
Stokes Research Institute.
NITS:
Nanowire/ Nanotube Infused Thermal Interface Material Integrated to
Thermal Management System (Enterprise
Ireland funded CFTD) in collaboration with
Stokes Research
Institute.
C-HiPerTIM:
Characterisation of High Performance Elastomer Nanocomposite Thermal
Interface Materials (NAP-177 project by Dr. Gordon Armstrong) in
collaboration
Materials and
Surface Science Institute.
E3Car:
Nanoelectronics for an Energy Efficient Electrical Car jointly funded by
Enterprise Ireland
and
ENIAC.
Patent
1.
K. M.
Razeeb, S. Roy, “Thermal
interface material for use as heat conduction path between power
semiconductor chips and thermal management system comprises body having
opposed faces, and aligned metallic submicron wires in body pores”,
Patent Application Number: WO2008129525-A1.
Selected Publications
1.
Kafil M. Razeeb, Alessio Munari, Eric Dalton, Jeff Punch and
Saibal Roy, “Thermal Properties of Carbon Nanotube-Polymer Composites
for Thermal Interface Material,” 2007 ASME-JSME Thermal Engineering
Conference and Summer Heat Transfer Conference July 8-12, 2007,
Vancouver, BC, Canada.
2.
Kafil M. Razeeb and Saibal Roy, “Thermal diffusivity of
non-fractal and fractal nickel nanowires”, J. Appl. Phys., 103(8),
084302-1-7, (2008). [download
pdf]
3.
Ju Xu, Kafil M. Razeeb and Saibal Roy, “Thermal Properties of
Single Walled Carbon Nanotube-Silicone Nanocomposites” J. Poly. Sci.
Part B: Poly. Phys., 46, 1845–1852, (2008). [download
pdf]
4.
Kafil M.
Razeeb, Ju Xu,
Eric D.
Dalton, Muhammad M. Ramli, Maurice N. Collins and Saibal Roy, “Thermal
properties of carbon nanotube-silicone composites”, accepted as book
chapter in “Polymer Composites: Properties, Performance and
Applications”, 2009.
5.
Alessio Munari, Ju Xu, Eric Dalton, Alan Mathewson and Kafil M.
Razeeb, “Metal Nanowire-Polymer Nanocomposite as Thermal Interface
Material”, 59th Electronic Components & Technology Conference
(ECTC 2009), 26-29 May, 2009, San Diego, CA, USA, pp. 448-452.
Contact:
Dr. Kafil M. Razeeb –
kafil.mahmood@tyndall.ie
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