Fabrication:

• 1.5 um & 5.0 um CMOS Silicon Fabrication
• E-beam Lithography
• Compound Semiconductor Fabrication (GaAs, etc.)
• Microsystems (Microfluidics, RF Switches, ect.)
• Laser Micromachining
• Plating (Microinductor fabrication, wafer bumping, etc)
• Polymer Microembossing
• Polymer Electronics Processing Line
  Link Central Fabrication Facilities web pages
  Link to Epitaxy & Physics of Nanostructures Facilities
  Link to Advanced Materials Growth Facilities
  Link to Nanotechnology Facilities
  Link to Bio-photonics & Mircofluidics activities
  Link to MEMS Test & Characterisation Facilities

Characterisation & Test:

• Microelectronic Device Electrical Characterisation
  Link to Device Characterisation
• IC-level Reverse Engineering
  Link to Design Technology Evaluation Group Equipment List
  
• Photonic Device Output Measurements
  Link to Photonics Systems Group Facilities
  
• SEM/EDX, AFM, FTIR, Raman Spectroscopy
  Link to SEM facilities
  Link to Semiconductor Analysis Equipment
• Ellipsometry, Deep Level Transient Spectroscopy
  Link to High-k Materials for Future IC Technology Facilities
• Tensile. Shear, Compressive & Cyclic Strength Tests
• TMA,TGA, DSC & DMTA
  Link to Thermomechanical Equipment
  
• Scanning Acoustic Microscopy, X-ray Imaging
• Decpasulation, Cross-Sectioning, etc.
• Package Seal & PIND Tests
  Advanced Magnetics Characterisation Facilities
  Magnetics Sensor Characterisation Facilities
  

• Circuit / Device Layout
• Integrated Circuit Design Extraction
• Thermal & Mechanical FE Simulation
  Link to Theory Modelling & Design web pages

• Wafer Dicing
• Die-attach / Chip Bonding
• Ink jet Solder Paste/ Epoxy Dispense
• Au and Al Wire Bonding
• Hermetic Sealing (Ceramic & Metal Packages)
• Chip-on-Board (COB) / Chip & Wire Assembly
• Adhesive & Solder Flip-Chip Assembly
• Epoxy Glob-top Encapsulation
• Solder Paste / Adhesive Screen Print
• Component Pick & Place
• IR Solder Reflow
  Link to Packaging activities

• Air-to-air Thermal Shock, Thermal Cycling
• Temperature Humidity Bias (THB) Testing
• Highly Accelerated Stress Test (HAST)
• High & Low Temperature Storage / Endurance
• Random Frequency & Swept Sinusoidal Vibration
• Mechanical Shock Testing
• Salt Spray Testing
  Link to Reliability Test Equipment
  Link to Failure Analysis Equipment
  Link to Reliability, Failure Analysis web pages