Capital Equipment
list of equipment purchased through NAP
These pieces of equipment are available to the research
community in Ireland under the National Access Programme.
......Please
contact nap@tyndall.ie if
you have any queries regarding this equipment......
NAP equipment
puchased in 2009 budget - further details to follow
Wafer
scale plating cell
Research area:
Plating
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Finetech
- Fineplacer
145 "PICO"
Research area:
Photonics Packaging & Integration
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Direct
Write Optical Lithography System
Research area:
Fabrication
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| Equipment:
Wafer scale plating cell - Specifications currently being
prepared for e-tender.
This is a dedicated
MEMs specific wafer scale plating apparatus. It will
enable high precision, high speed plating through the use
of rotating workpiece and reverse pulse plating rectifier.
Due: Selection of equipment to be made on
completion of e-tender process - details to follow
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Equipment:
Fineplacer 145 "PICO"
NAP will contribute to the purchase of this system.
Used for the placement of
high pin count SMDs & Flip Chip onto PCBs and other
substrates. This system enables packaging and integration
of photonic, electronic and microsystem components
directly from wafer and/or gel packs on to substrates.
Due: September
2009 |
Equipment:
Direct Write Optical Lithography System - Specifications
currently being prepared for e-tender.
The ability to direct write
optical patterns is of significant benefit. Often the
patterns required are ‘once-off’ and the masks are
expensive. This capability would allow small design
changes to be made without the added cost of getting new
photomasks.
Due: Selection of equipment to be made on
completion of e-tender process -
details to follow |
NAP equipment
puchased in 2008 budget - Click on photo for details
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E-beam
Software
GenISys GmbH
Installed October 2008 |
Micromachining system
Hardinge
Bridgeport GX 480
Installed March
2009 |
Microwave Plasma System
PVA-TePla
Installed June 2009 |
NAP equipment
puchased in 2007 budget - Click on photo for details
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Ellipsometer
J.A.
Woolam
Installed February 2008 |
Post
CMP
cleaning tool
Nanomaster
Inc.
Installed February 2008 |
Helium Cadmium Laser
Kimmon
Installed March 2008 |
Calibrated optical
detector system
Newport
Installed February 2008 |
NAP equipment
puchased in 2006 budget - Click on photo for details
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Micro
RAMAN
Renishaw
inVia reflex Raman Microscope
Installed November 2006
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Atomic Force Microscope
Dimension
3100 SPM
Installed
July 2007
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FTIR
ATR accessory
Pike
Miracle with builtin diamond ATR crystal
Installed October 2006 |
TMA upgrade
Installed |
CV meter
Installed |
100nm
Calibation standard
Installed |
NAP equipment
puchased in 2005 budget
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Spinner
Opti Coat SB 20+ SSE (GmbH)
Installed September 2005
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High Precision Wafer Dicing Saw
Disco
Hi-Tec
Installed February 2006
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CMP system
CDP System from Logitech Ltd
Installed January 2006
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Probe Station with Micro chamber Facility
Cascade Microtech Ltd.
Installed August 2005 |
SEM/EDX Workstation & Software Upgrade
Princeton Gamma Technology (PGT)
Installed July 2005 |
Software
Manufacturer: GenISys GmbH
Model: Layout Data Preparation and Proximity Effect Correction for E-Beam Lithography
Installed: October 2008
Description: The Layout BEAMER is a data preparation and proximity effect correction software for demanding applications in direct write. It enables the flexible design of demanding preparation processes with highly efficient import of large layout data, rich postprocessing functions, latest technology proximity effect correction and an efficient viewer for inspection.
The unique database driven, modular, process flow oriented concept combines performance and user-friendliness.
Typical
use/applications: A
software package to allow the correct writing of close packed
patterns on an e-beam lithography system.
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Micromachining system
Manufacturer: Hardinge
Bridgeport
Model: GX 480
Installed March 2009
Description: The Hardinge designed and built Bridgeport VMC GX 480 machine features a high quality cast iron “C-frame” with extra wide machine base and column for superior rigidity and durability. Structural components and castings are qualified by Finite Element Analysis(FEA) a well-established and proven procedure for machine tools built by Hardinge.
Typical
use/applications: Micromachining system for making moulds for polymer microinjection moulding and other parts which need very precise tooling.
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Microwave
Plasma System
Manufacturer: PVA-TePla
Model:
Microwave Plasma System 210
Installed June 2009
Description: PVA TePla is a market leader in microwave plasma processing used in the fabrication of microchips, MEMS devices, photovoltaic cells, flat panel displays and detectors, etc. Semiconducting materials such as silicon, III/V compounds, lithium niobate etc. are processed in the safe environment of microwave generated plasmas for applications such as photoresist ashing, wafer thinning and stress relief, bond pad cleaning prior to wirebonding, and activation prior to over-molding. Microwave plasmas are especially suited to treating devices that are electrostatically sensitive.
The Microwave Plasma System 210 is our most popular full
featured plasma surface modification system designed for
laboratory and production use.
Typical
use/applications: Photoresist stripping after wet etch, ion implantation, sputter etching, RIE etc.; Surface cleaning prior to wet etching;
Removal of organic layers like Polyimide, SU-8, etc.; Etching of passivation layers; Etching of polysilicon, silicon nitride;
Device decapsulation by removal of organic mold compound encapsulant (manual removal of the filling powder required); General plasma chemistry;
Low temperature ashing of organic material for trace analysis; Cleaning of filters prior to asbestos fibre analysis. Plasma Chamber for releasing MEMs devices.
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Ellipsometer
Manufacturer: J.A.
Woolam
Model: M-2000U
Installed: February 2008
Description: Many of
the processes in the Compound Semiconductor Processing lab
involve depositing and etching thin films such as dielectrics
and metals. An ellipsometer will provide an in-lab facility for
the accurate measurement of the properties of these thin films
and material structures. Model "U" (for ultraviolet) ellipsometer is ideal for a large variety of applications, including both in-situ and ex-situ measurements of dielectrics, polymers, semiconductors, metal, etc. A spectral range from 245nm to 1000nm covers critical pints in semiconductors, making it useful for measuring and controlling compound semiconductor alloy ratios. A broad range of film thick nesses (sub-nanometer to 10 microns) are accessible with its resolution of 470 simultaneously measured wavelengths.
Typical
use/applications: The ellipsometer is
of fundamental importance to the Photonics users of the lab to
be able to measure the refractive index and thickness of
dielectric coatings used on laser devices.
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Post
CMP Cleaning Tool
Manufacturer: Nanomaster Inc.
Model: SWC-4000
Installed February 2008
Description: Megasonic Single Wafer & Mask Cleaning Systems for the state of the art damage-free megasonic cleaning of substrates with the highest resolution patterns by controlling uniform distribution of the acoustic energy density across the entire surface of the substrate. Particle release off the surface is enhanced with chemical dispense and then the released particles are removed from the substrate surface allowing the least number of reattachments by sweeping off with the radial flow of the DI water. This patented technology provides reproducible and uniform cleaning of the wafers, masks and other delicate substrates with maximum megasonic energy just below the damage threshold of parts to be cleaned.
Typical
use/applications: Post-CMP wafer cleaning to remove slurry residue from wafers.
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Helium Cadmium Laser
Manufacturer: Kimmon (Distributor PHOTONIC SOLUTIONS PLC)
Model: IK Series
Installed March 2008
Description: A
He-Cd laser provides continuous wave ultra-violet light emitting
at 325nm. The laser is configured to measure the
photoluminescence from wide bandgap semiconductors and organic
materials. HeCd laser emitting in the UV and visible region of the spectrum. It emits 5mW at 325nm and 35mW at 442nm.
The laser can also be used in holographic, two photon
structuring and Raman spectroscopy for example.
Typical
use/applications: Photoluminescence
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Calibrated
Optical Detector System
Manufacturer: Newport
Model: TBA
Installed February 2008
Description: An
optical detector system with a range of detector heads permits
calibrated measurements of light intensity from lasers and LEDs
emitting from the near UV to the near IR (350 nm – 1600 nm).
Power levels from the 10 nW to 1 W can be measured.
Calibrated measurements of extended sources such as LEDs can be
made in conjunction with an integrating sphere.
Typical
use/applications: Power level measurement and verification
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Micro Raman
Manufacturer: Renishaw
Model:
inVia reflex Raman Microscope
Installed November 2006
Description: The Renishaw inVia Raman microscope has become the world's best selling research Raman system. The inVia Raman microscope combines simplicity of operation with the high performance and unparalleled flexibility for which Renishaw Raman systems are renowned. inVia Raman microscopes are high-sensitivity systems with integrated research grade microscopes, enabling high resolution confocal measurements. inVia Raman microscopes support multiple lasers, with automatic software switching of excitation wavelength.
Renishaw Invia Reflex MicroRaman with automated mapping capabilities and 514nm laser excitation
Typical
use/applications: Since Raman is very sensitive to the
molecular bonding and structure of a sample it produces very
specific spectral 'fingerprints'. These fingerprints can be used
for chemical identification, morphology and phase, intrinsic
stress/strain and component distribution studies and analysis.
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Atomic Force Microscope
Manufacturer:
Model: Veeco
Dimension
3100 SPM
Installed
July 2007
Description: The diDimension™ 3100 performs all the major scanning
probe microscopy techniques and a wide range of standard and advanced characterization applications,
making it one of the world’s most multi-functional SPMs. The system offers unmatched flexibility through
field-upgradable scanner, controller, and image mode options. Precise laser tracking and the ability to change
scanning techniques easily guarantees ease of use and high sample throughput. A host of other innovative
features and a proven record of reliability have helped the Dimension 3100 to become one of the most
sought-after SPM systems in research and industry.
Typical
use/applications: Imaging modes to measure surface
characteristics for semiconductor wafers, lithography masks,
magnetic media, CDs/DVDs, biomaterials, optics, and other
samples
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FTIR
ATR Accessory
Manufacturer:
Model:
Pike
Miracle with builtin diamond ATR crystal
Installed October 2006
Description: The PIKE MIRacle™ is a universal ATR sampling accessory for analysis of solids, liquids, pastes, gels, and intractable materials.
In its most popular configuration it is a single reflection ATR accessory with high IR throughput which makes it ideal for sample identification and QA/QC applications. Advanced options include three reflection ATR crystal plates to optimize for lower concentration components. Easily changeable crystal plate design provides analysis of a broad spectrum of sample types while ensuring constant sampling path length.
Typical
use/applications: Analysis of solids, liquids, pastes, gels, and intractable materials.
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TMA Upgrade
Manufacturer:RHEMOTRIC Scientific
Model:TMA500 & TGA1000
Installed
Description: New
software & computer upgrade installed to enable easier
retrieval of data.
Typical
use/applications: TMA500 enables measurement of CTE
(coefficentient of thermal expansion), TGA1000 enables
measurement of weight changes due to curing, compositional
changes etc. Both TGA & TMA are used in the anlaysis of
polmers, adhesives, solders and encapsulants for microelectronic
packaging.
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100nm
Calibation Standard
Manufacturer:
VLSI Standrads Incorporated
Model: NanoLattice Pitch Standard NLSM
Installed
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SEM
image of 100 nm pitch calibration sample |
High
Resolution TEM image of a cross-section of the 100 nm
pitch calibration sample |
Standard
is used to calibration the Jeol JSM 6700 SEM |
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Description: The
NanoLattice standard is a 1.2 mm x 1 mm etched silicon grating
with a nominal pitch of 100 nm. Each grating is continuous over
a large certified area, permitting tens of thousands of
measurements. Global alignment marks located 25 mm from the
center of wafer on both sides of the chip can be used to assist
pattern recognition and automation. Each standard is
individually mounted.
Typical
use/applications: Used to calibrate
magnification and scan
linearity of CD-SEM and Atomic Force Microscopes (AFM).
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CV meter
Manufacturer: Agilent
Model: Precision
Impedance Analyzer 4294A
Installed July 2006
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Meter
used in conjunction
with Cascade Prober |
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Description:
The
Agilent 4294A is a general purpose impedance measurement
instrument. It is based on the auto balancing bridge method
allowing a large impedance measurement range over a wide
frequency range (40Hz-110MHz). It provides high accuracy and
advanced measurement functions. The frequency, DC bias and AC
voltage/current level continuous sweep is available.
Equivalent-circuit analysis is possible thanks to multi-element
circuit model availability.
Typical
use/applications:
- Components evaluation
(e.g. capacitors, inductors)
- Semiconductor devices
and process evaluation
- Material
characterisation (e.g. permittivity, permeability)
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Spinner
Manufacturer: SSE (GmbH)
Model: OPTIcoat
20+
Installed September 2005
Description: The
OPTIcoat SB 20+ Coating System is a coating spinner with a
process optimized covered chuck technology for 2” to 8”
wafers or up to 6”x 6” substrates. The new design of the
three piece process bowl and the covered chuck technology
provides excellent coating uniformity and repeatability,
especially for thick resist layers, high topography or square
substrates.
Typical
use/applications: The covered chuck technology provide excellent
coating uniformity and repeatability, especially for thick resist layers, high topography or
square substrates.
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High Precision Wafer Dicing Saw
Manufacturer: Disco
Hi-Tec
Model: 3350
Installed February 2006
Description: The 3000 series features an auto-alignment function,
LCD touch panel, and graphical user interface. DAD3350 features a 1.8 kW spindle for excellent cutting results and a highly rigid
bridge-type frame structure for excellent process stability. The system
can accept wafers up to 8”and deploys a spindle can tilt to 10 degrees
for cutting facets on chips for photonic applications.
Typical
use/applications: Dicing wafers
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CMP system
Manufacturer: Logitech Ltd (UK)
Model: CDP Automatic
Installed January 2006
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CMP
System |
Metal_2
– ILD – Metal_1 un-planarized |
Metal_2
– ILD – Metal_1 after CMP |
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Description:
The CDP Automatic is a highly versatile
Chemical-Mechanical-Polishing (CMP) system. It offers
nanometre-level material removal capabilities on both individual
die and wafers (up to 200mm) and can be used with a wide variety
of substrates & material layers. The system is equipped with
end-point detection for precise control of the process.
Typical
use/applications:
Typical
applications for the CDP are ILD planarization and 'Damascene'
patterning of metal layers.
ILD planarization is a critical
step for multi-layer metal CMOS devices, CMP is used to remove
the topography introduced by conformal deposition over patterned
circuit layers by preferentially removing thicker/higher points
across the surface which leaves the top surface flat and allows
for higher levels of device integration.
'Damascene' patterning of metal
layers allows the use of materials in IC devices which were
previously impossible to use due to the lack of dry-etch
processes, the most obvious example being Copper Interconnect.
In a reverse of the traditional flow for metal-patterning,
trenches are first etched into the wafer surface and then the
metal layer is blanket-deposited onto the surface. CMP is then
used to remove the metal from the top-surface, but the metal in
the trenches remains to form the interconnect.
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Probe Station
With Micro Chamber Facility
Manufacturer: Cascade Microtech Ltd.
Model:
Summit
12971B
Installed August 2005
Description:
This
semiautomatic
probe station is equipped with a thermal chuck to enable on-wafer
electrical characterisation from -55oC to 200oC.
The 200mm chuck (small samples can also be tested) is enclosed in
a microchamber facility with controlled ambient (Dry air). This
low noise and low leakage environment facilitates low level (~1fA)
measurements.
Typical
use/applications:
- On-wafer
DC
parametric measurement for device modelling
- MOS CV
- CV and IV thermal
measurement capabilities
- Device
Reliability
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SEM/EDX Workstation & Software Upgrade
Manufacturer: Princeton Gamma Technology (PGT)
Model: Avalon 8000
Installed July 2005
Description: Upgraded
hardware and software to enhance the EDS detection system attached
to the Hitachi FE-Scanning Electron Microscope.
Typical
use/applications: Qualitative Xray anaysis of samples, along
with image grabbing software and digital dot mapping capabilities.
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