Tyndall Low-Volume Packaging Processes:

• Hermetic ceramic package assembly.
• Hybrid circuit & Multi-Chip Module (MCM) assembly.
• Chip-on-Board (CoB) assembly.
• Optoelectronic / photonics packaging.
• Flexible Circuit Fabrication.

Chip-on-Board packaging for sensors

Semiconductor Thinning, Lapping & Polishing:

• Semiconductor thinning to 100µm (part wafers / pieces) only.
• Normal , 8° & 45° facets polish.
• Polymer & silica recipes.
• Typical surface roughness  = 20-30nm

Logitech wafer grinding / polishing system

Wafer Dicing:

• Fully automated DISCO Hi-Tec DAD3350 saw.
• Up to 8'' (150mm) wafers.
• Die sizes from 1.0mm x 1.0mm.
• Angled facets possible.
• Accuracy <+- 3um.
• Wafer thicknesses up to 700um.
• Range of wafer materials (Si, GaAs, glass, sapphire, etc) handled.

 
DISCO Hi Tec DAD3350 dicing saw

• Automated epoxy dispense.
• Die-attach (conductive or non-conductive adhesive).
• Glob top encapsulation for chip-on-board.
• High accuracy “dam & fill” encapsulation
• Selective encapsulation for sensor devices.
• Flip-chip under fill.
• High accuracy ink-jet dispense for polymers & solders.

Newport ink-jet dispense system

Wire Bond Facilities:

• 25um Al-wire wedge bonding

• 25um Au-wire ball bonding

• Au ribbon bonding

• 300 µm  Al wire bonding for power packaging applications

• Royce micro-tester for bond strength measurement to Mil-Std-883F, Method 2011.7.

Au Ribbon Bonder

Flip-Chip Bonding Facilities:

• Solder (C4) & adhesive (e.g. conductive adhesive, ACA film, etc.) bonding.

• Placement accuracy to ­­± 1.0µm.

• Bonding process temperature up to 400şC.

• Bonding force from 200g to 20kg.

• Planarity control.

• Ultrasonic & thermosonic bonding possible.

• Inert gas bonding atmosphere possible.

• Under fill dispense & cure for enhanced strength & reliability.

RD Automation – M8-AN Flip-Chip Bonder

Hermetic Sealing:

• Metal & ceramic packages (TO cans, DIL, CERDIP, CPGA, CQFP, etc.).

• Solder & glass reflow lid-sealing (process temp = up to 450şC).

• Inert atmosphere (e.g. nitrogen) sealing possible.

• Vacuum sealing possible.

• Helium fine leak test (Veeco MS18AB) to Mil-Std-883F, Method 1014.11, Cond. A1.

• Perfluorocarbon gross leak test (Trio-Tech) to Mil-Std-883F, Method 1014.11, Cond. C1.

• Particle Impact Noise Detection (PIND) test to Mil-Std-883F, Method 2020.8, Cond. A.

Reflow system for hermetic package sealing

Optoelectronic / Photonics Packaging Capabilities:

Laser Weld System:
•         Assembly of “butterfly” packages
•         2-beam or 3-beam configurations.
•         Adaptable to other package types.

Fibre / Planar Device Alignment & Bonding:
•         50nm positional accuracy.
Automated alignment & bonding of active optical devices.

Tyndall’s fibre / planar device alignment & bonding system

Packaging for Power Devices:

• Assembly on metallised ceramic substrates or power packages.

• Solder die attach  / solder flip chip.

• 300 µm Aluminium wire bonding.

• IR thermal imaging.

• Thermal resistance (Rθ_jc) measurement.

Power converter on ceramic substrate

Packaging Test, Analysis & Quality Evaluation Capabilities:  

• High magnification optical & SEM inspection.

• X-ray imaging (real time & high resolution film).

• Scanning Acoustic Microscopy Imaging.

• Bond pull & die shear tests for wire bond, flip-chip & die-attach evaluation.

• Fine & gross leak tests for seal quality evaluation.

• PIND (Particle impact noise detection) test for cavity packages.

• Multicore MUST wetting balance solderability test.

• Microsectioning (encapsulated cross-section prepared to 1µm polished finish).

• Chemical decapsulation (for removal of plastic moulding compounds).

• Materials & contaminant analysis (EDX, FTIR & Raman).

Wire bond inspection using SEM

X-ray image of micro power converter

For further details contact:

For further details, please contact either of the following:

Mr. Finbarr Waldron                           Tel:  + 353 (0)21 490 4093                    E-mail: finbarr.waldron@tyndall.ie

Mr. Ken Rodgers                                  Tel: + 353 (0)21 490 4226                        E-mail: ken.rodgers@tyndall.ie

Ref: www.tyndall.ie/nap/packaging.html