Assembly/ Packaging

The new research building has enabled Tyndall to bring together all of its Microelectronics, Microsystems and Photonics packaging capabilities into one comprehensive facility with two key new laboratories – a packaging cleanroom where assembly is carried out and a supporting analytical laboratory where completed assemblies are tested and characterised. These new laboratories, part-funded by the Higher Education Authority under the Fourth Cycle of the Programme for Research in Third Level Institutions, offer state-of-the-art capabilities for packaging process development (i.e. wafer thinning, wafer dicing, ink-jet micro dispense, wire bonding, flip-chip bonding) along with specialised capabilities in laser welding & fibre alignment required for photonics integration. The new facilities will be used for the development and evaluation of device packaging processes for Tyndall’s industry and research partners.

A summary of all the services and equipment available for use at Tyndall is provided under the Services section of this website. Here are the direct links:

 

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