Since its inception, NMRC has had a policy of up-grading existing facilities and investing in new facilities to meet the constantly changing demands of technological research in the Centre. The Centre currently has a total floor area of 5,990m2 of laboratory and support space with funding in place to expand this by an additional 1300m2 in the coming year. This expansion will facilitate a state-of-the-art e-beam nanofabrication facility and a polymer processing fabrication line along with additional semiconductor processing capabilities for microelectronic, photonic and microsystems research programmes.

Researchers and students are given access to a full range of fabrication facilities through the Central Fabrication Facility and can avail of a wide range of measurement and analysis laboratories. The processing laboratories are supported by a full CAD capability.

A brief overview of capabilities is detailed below:-

• Silicon
  The Silicon Fabrication Facility is used as a pilot production line for novel processes as well as a prototyping facility for industry partners. The facility occupies a combination of Class 10 and Class 1000 cleanrooms.

Silicon Fabrication Facility tour by Joint Oireachtas Committee for Enterprise and Small Business.
• Optoelectronics
  Both optoelectronics growth and fabrication facilities are available. The Optronics Ireland metal organic vapour phase (MOVPE) growth laboratory comprises two MOVPE reactors and ancillary characterisation equipment. These consist of a horizontal 2-inch wafer reactor designed for the growth of phosphide-bearing compounds and a 3-inch wafer reactor being used for the development of a novel GaN growth process. The compound semiconductor processing facility enables the fabrication of optoelectronics devices, components and hybrid systems.
• Microsystems
  

  High aspect ratio resist patterning for MST components.

  The Microsystems Technology (MST) Fabrication Facility was established to support the rapidly growing MST activities within the Centre. The laboratory is dedicated to non- CMOS compatible processes and microsystems technology, used in the development of products such as micromachined modules for hybrid component integration in telecommunications, pressure sensors for multi-site sensing, micro-electromechanical switches and integrated magnetic storage systems on silicon.

• Advanced Lithography Laboratory and Nanosystems Fabrication Facility
  A new development has been the initiation of a nanolithography and device fabrication facility. This laboratory will support all nanoscale device and systems research throughout the Centre by providing a full capability in nanostructure fabrication. Facilities will include a state-of-the-art electron beam lithography unit for direct write and some mask making applications along with a suite of non-photolithographic ‘soft- lithography’ tools comprising microembossing equipment for nanoimprint lithography and self-assembled monolayer based micro-contact printing and polymer based micromoulding technologies. Complementary materials etching and deposition facilities will also be available to enable fabrication of advanced nanoelectronic and nanophotonic devices and systems.
• Biomaterials Laboratory
  This laboratory supports the molecular electronics research effort and houses specialised biotechnology based equipment for synthesis, manipulation and self-assembly/patterning of molecules at semiconductor surfaces. A full DNA synthesis and surface patterning capability is available along with facilities for synthesis of organic and inorganic molecules as well as metal and semiconductor nanocrystals.
• Laser Micro-machining Facility
  The excimer laser micro-maching facility comprises an ATLex excimer laser and LightDeck machining station. The system operates on the ArF system (wavelength 193nm). The laser can be used for pattern projection machining or for point to point machining. A laser induced chemical etching process unit is currently under development. This will extend the current materials machining capability from low thermal conductivity materials, such as polymers and glasses, to semiconductors and metals.
• Submillimetre Wave
  This facility utilises the compound semiconductor processing laboratory for the fabrication of submillimetre wave devices and components. The associated test facility comprises equipment for full device parameter measurement at ambient and cryogenic temperatures and an automated system for long term reliability studies at elevated temperatures.
• Plating Laboratory
  Figure: Wafer Plating Fixtures

  The plating laboratory, which is housed in a class 10,000 cleanroom environment comprises two plating lines, for cleaning, activating, electroless processing (including lithography) and electroplating of wafer sizes from 4 to 8 inch. These facilities are used for plating of flip-chip bumps on silicon, fine-line copper interconnect on ceramic and silicon and plating of micro-electromechanical switches on silicon.

• Polymer Laboratory
  The polymer laboratory has been initiated with the goal of establishing a full capability in the inert processing of organic oligomeric and polymeric materials for electronic and photonic applications.
• Semiconductor Analysis
  

  The semiconductor analysis laboratory focuses on measurement of fundamental semiconductor properties crucial to device performance. Non-destructive electrical testing is available via Surface Charge Analysis (SCA). Atomic Force Microscopy (AFM) is used to determine the microstructure of semiconductor materials. SIMS is available for elemental analysis. A full range of optical techniques is also available.

  SIMS profile of multi-level SiGe structure.

• Packaging and Assembly
  

  Flip-chip bumping

  State-of-the-art laboratories include processing and assembly equipment for COB, BGA, CSP and flip-chip assembly using both lead-free solders and anisotropically conducting adhesives and surface mount assembly of prototype boards. A power semiconductor assembly facility incorporating high thermal conductivity solder die attach and high current wire bonding is also available.

• Package Characterisation Laboratory
  

  The package characterisation laboratory includes thermal, mechanical and electrical characterisation facilities. Thermal characterisation expertise includes thermal resistance measurements, infra-red thermal imaging, wind tunnel and measurement of material thermal conductivity. A range of mechanical test and scanning acoustic microscopy equipment is also available.
  Dynamic thermomechanical testing of lead-free solder assemblies

• Product Qualification
  
  Wind tunnel testing of electronic circuit boards

  A full range of stress test services to evaluate the long-term reliability of electronic products to specifications such as Mil Std. 883E is available. These include thermal shock testing, temperature humidity testing, HAST, high / low temperature storage and vibration testing. A salt spray chamber enables evaluation of components and systems in corrosive environments. These facilities, in conjunction with NMRC's IC, materials and failure analysis capabilities, enable the Centre to provide a comprehensive component reliability evaluation service.

• Environmental Science Analysis
  The environmental analysis laboratory comprises a purpose-designed facility with plasma emission spectrometry, ion chromatography and liquid chromatography equipment.
• IC Test Laboratory
  

  Design Evaluation using a HP820000 mixed signal tester

  The IC test laboratory provides electrical and physical evaluation of IC's at package and wafer level. Test resources include two HP82000 systems, two HP4062UX systems and a HP8722 based RF measurement system. In addition, an SRP doping profiler and emission microscope are used for process debugging as well as supporting industry projects that require IC design characterisation, patent infringement investigation, smart-card security assessment, process evaluation, low level measurements and RF characterisation.

Moire interferometry strain analysis. Components analysed at NMRC by the Moire technique include microelectronics, microsystems and micromechanics systems.	Saltspray testing of power modules.
Surface charge analyser.	Laser scatterometry testing of excimer laser mirror damage.