References - List of Publications

[ in text referred to as (P...)]

P1 G. Kelly
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, Kluwer Academic Publishers P.O. BOX 17, 3300 AA Dordrecht the Netherlands. In the US, Boston Kluwer Academic Publishers 101 Philip Drive, Norwell, MA, 020601 USA, ISBN 0-7923-8485-7, Published April 99, 134 pages. Hardback.
P2 E. Hynes, D. McAuliffe, M. O'Neil, W. A. Lane, G. Kelly, and H. Berney
Development and characterisation of a surface micromachined FET pressure sensor on a CMOS process, Sensors & Actuators Part A: Physical, 76, 282-292, 1999.
P3 A. Morrissey, G. Kelly, and J. Alderman
Selection of Materials for reduced stress packaging of microsystem, Sensors & Actuators Part A. Physical, 74, 178-181, 1999.
P4 A. Morrissey, J. Alderman, G. Kelly, Z. Kohari, A. Phai, and M. Rencz
Packaging and thermal evaluation of a thermally operated intelligent micropump unit, Microelectronics Journal, 30, 1109-1114. 1999
P5 M. Nolan and J. C. Greer
Molecular Dynamics Studies of Phase Transitions of Homoploymers of p-Hydroxybenzoic Acid, Journal of Physical Chemistry 103 B, 7111-7123, 1999.
P6 J. C. Greer
Electronic correlation energy in linear and cyclic carbon tetramers, Chemical Physics Letters 306, 197-201, 1999.
P7 J.A. Larsson and D. Cremer
Theoretical Verification and Extention of the McKean Relationship Between Bond Lengths and Stretching Frequencies, Journal of Molecular Structure 485-486, 385-407, 1999
P8 D. J. Paul, B. Coonan, G. Redmond, B. J. O'Neill, G. M. Crean, B. Hollander, S. Mantl, I. Zozoulenko, K.-F. Berggren, J.-L. Lazzari, F. Arnaud d'Avitaya, and J. Derrien
Silicon Quantum Integrated Circuits -an attempt to fabricate silicon-based quantum devices using CMOS fabrication techniques, Thin Solid Films 336, 130-136, 1998.
P9 B. P. Coonan, N. Griffin, G. Redmond, J. Beechinor, M. Murtagh, G. M. Crean, B. Hollander, S. Mantl, J-L. Lazzari, F. Arnaud d'Avitaya, and J. Derrien
Investigation of Si/SiGe Heterostructure material using non-destructive Optical Techniques, Thin Solid Films 364 (1-2) 75-79, 2000.
P10 M. Murtagh, J. T. Beechinor, N. Cordero, P. V. Kelly, G. M. Crean, and S. W. Bland
InGaP/GaAs Based Heterojunction Bipolar Transistor Characterisation Using Non-Contact Optical Spectroscopy, Material Science and Engineering B 66 (1999), 185-188.
P11 M. B. Mooney, P. K. Hurley, B. J. O'Sullivan, J. T. Beechinor, P. V. Kelly, G. M. Crean, J.-Y. Zhang, I. W. Boyd, J.-P. Sonateur, C. Jimenez, and M. Paillous
Characteristics of tantalum pentoxide dielectric films deposited on silicon by excimer-lamp assisted photo-induced CVD using an injection liquid source, Microelectronic Engineering 48 (1999), 283-286.
P12 D. J. Macauley, P. V. Kelly, K. F. Mongey, and G. M. Crean
Atmospheric pressure excimer lamp-assisted photoselective activation process for electroless plating, Applied Surface Science 138/139 (1999), 622-626.
P13 D. J. Macauley, P. V. Kelly, K. F. Mongey, and G. M. Crean
Effects of plasma on excimer lamp based selective activation processes for electroless plating, Applied Surface Science 138/139 (1999), 62-67.
P14 M. D. Whitfield, B. Audic, C. M. Flannery, L. P. Kehoe, G. M. Crean, and R. B. Jackman
Acoustic wave propagation in free standing CVD diamond: Influence of film quality and temperature, Diamond and Related Materials 8 (1999), 732-737.
P15 S. Foley, J. Molyneaux, and A. Mathewson
An evaluation of fast wafer level test methods for interconnect r eliability control. Microelectronics Reliability , Vol 39 No 11 (1999),1707-1214.
P16 C. Ciofi, V. Dattilo, B. Neri, S. Foley, and A. Mathewson
Long term noise measurements and MTF test for the characterisation of electromigration in metal lines, Microelectronics Reliability, Vol 39 no 11 (1999),1691-1696.
P17 S. Foley,,L. Floyd, and A. Mathewson
A novel rapid technique for detecting voiding damage in IC interconnects, Microelectronics reliability Vol 40. (2000), 87-97.
P18 S. J. Bellis, W. P. Marnane, and P. Larsson-Edefors, Bit-serial, MSB first processing units. International Journal of Electronics, v. 86, n. 6, 1999, 723-738.
P19 M. M. Madeira, S. J. Bellis, L. A. Aguilar Beltran, J. Solano Gonzalez, D. F. Garcia Nocetti, W. P. Marnane, M. O. Tokhi, and M. G. Ruano
High-Performance Computing For Real-Time Spectral Estimation. Control Engineering Practice , v. 7, n. 5, 1999, 679-686.
P20 K. Palser, R. Duffy, A. Concannon, and A. Mathewson
Analysis of External Latch-up Protection test structure Design Using Numerical Simulation, Microelectronics Reliability, Vol. 39, (1999), 647-659.
P21 A. Mathewson, P. O'Sullivan, A. Concannon, S. Foley, S. Minehane, R. Duane, and K. Palser
Modelling and Simulation of Reliability for Design, Microelectronics Reliability, Vol. 49, (1999), 95-117.
P22 M. Meinhardt, et al
Multilevel Converters for Single-Phase Grid Connected Photovoltaic SystemsÐ An Overview, Solar Energy, vol. 66, no. 5, August 1999, 325-335.
P23 M. Meinhardt, V. Leonavicius, J. Flannery, and S. C. O'Mathuna
Impact of Power Electronics Packaging on the Reliability of Grid Connected Photovoltaic Converters for Outdoor Applications, Journal of Microelectronics Reliability 1999, 1461-1472.
P24 K. Delaney, J. Barrett, J. Barton, and R. Doyle
Characterisation and Performance Prediction for Integral Capacitors in Low Temperature Co-Fired Ceramic Technology, IEEE Trans. Components, Packaging & Manufacturing Technology, Vol. 22, No. 1, Feb. 1999, 68-77.
P25 K. Delaney, J. Barrett, J. Barton, and R. Doyle
Characterisation and Performance Prediction for Integral Resistors in Low Temperature Co-Fired Ceramic Technology", IEEE Trans. Components, Packaging & Manufacturing Technology, Vol. 22, No. 1, Feb. 1999, 78-75.
P26 M. Lozano, G. McCarthy, J. Barton, R. Doyle, J. Santander, E. Cabruja, C. Perello, M. Ullan, and E. Lora-Tomayo
Test Structures for MCM-D Technology Characterisation, IEEE Transactions on Semiconductor Manufacturing, May 1999, Volume 12, Number 2,pp. 184-192.
P27 S. Fuchs, J. Barrett, F. Stam, and K. Rindelhardt
A Simple Modification to a Flip-Chip Bonder to Allow Large Area Chip Attach, Microelectronics International, Vol. 16, No. 1, January 1999, 8-12.
P28 W. G. Hurley, M. Duffy, S. O ' Reilly, and S. C. O'Mathuna
Impedance Formulas for Planar Magnetic Structures with Spiral Windings, IEEE Transactions on Industrial Electronics, Vol. 46, No. 2, April 1999, 271-278.
P29 D. Brennan, J. Alderman, W. Lane, and B. O'Connor
Feasibility study into the use of a micro-machined grating spectrometer to measure fat and protein content in liquid milk products, Sensors and Actuators 76, 1999, 314-317.
P30 M. M. McEnery, A. Tan, J. Alderman, J. Patterson, S. C. O'Mathuna, and J. D. Glennon
Fabrication of a Miniaturised Liquid Chromatography Separation Channel on Silicon, J. Capillary Electrophoresis and Microchip Technology, 006:1/2 (1999) 33-36.
P31 H. Berney, J. Alderman, W. A. Lane, and J. K. Collins
Development of a generic IC silicon transducer for immunoreactions, Sensors and Actuators B, 57, 1999, 238-248.
P32 H. Berney, A. Kemna, E. Hynes, M. O ' Neill, M. Hill, and W. Lane
Critical processing issues for micromachined structural layer etching and sealing, Sensors and Actuators A, 76, 1-4, 1999, 356-364.
P33 E. Hynes, D. McAuliffe, M. O'Neill, W. Lane, G. Kelly, M. Hill, and H. Berney
Development and characterisation of a surface micromachined FET pressure sensor on a CMOS process, Sensors and Actuators B,(1999), 76, 1-3.

 

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