Oxide interfaces

The silicon (100) surface with a silicon dioxide layer forms the interface of most relevance to modern microelectronics technology, as it lies at the heart of modern MOSFETs. The semiconductor/oxide interface is being studied by density functional theory (DFT) calculations on model systems.

Silicon oxide layers formed between silicon substrates and oxides with large dielectric constants (high k) play an important role in determining electrical properties for microelectronic applications such as gates stacks and capacitors. In particular, interfacial layers set limits on the equivalent oxide thickness (EOT) for high k oxides formed on silicon. For sub-nanometer interfacial layers, an amorphous, non-stoichiometric oxide forms; an increase in the dielectric constant relative to SiO2 in this layer has been inferred from experiment and theoretically predicted. Formation of oxygen vacancies within interfacial layers further reduces the oxygen content and acts to increase the dielectric constant.

We have investigated oxygen vacancy formation at silicon/oxide interfaces and find that their formation is energetically more favorable in non-stoichiometric SiOx than in SiO2, implying a higher density of oxygen vacancies within interfacial layers. A representative interface structure is shown here.

For oxide layers occurring at high k/silicon interfaces (shown on right), the reduced stoichiometry relative to bulk silica implies that oxygen removal has taken place. Coupled to the observation that oxygen vacancy formation in silica is more favorable than in HfO2, it is inferred that oxygen is kinetically driven away from the interface towards the hafnia layer. This effect contributes to reducing the stoichiometry in the SiOx region, with an accompanying increase in interfacial dielectric constant.

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Representative structure of interface between high-k (HfSiO4) and silicon (blue=Hf, yellow=Si, red=O).
Publication Volume Pages Year Publication Title List of Authors
PHYS REV B 73 165312 2006 Computational Design of Si/SiO2 Interfaces: Stress and Strain on the Atomic Scale A. Korkin, J.C. Greer, G. Bersuker, V. Karasiev, R.J. Bartlett
APPL PHYS LETT 90 143511 2007 Stress in silicon interlayers at the SiOx/Ge interface S. O'Callaghan, S. Monaghan, S.D. Elliott, J.C. Greer
PHYS REV B 75 245304 2007 Atomic scale model interfaces between high-k hafnium silicates and silicon S. Monaghan, J.C. Greer, S.D. Elliott
PHYS REV B 75 245304 2007 Atomic Structure of Interfaces between High-k Hafnium Silicates and Silicon S. Monaghan, J.C. Greer, S.D. Elliott
Hafnium pseudo-binary oxides, (HfO2)x(SiO2)1-x, are being considered as high-k gate dielectrics in field effect transistors, as a compromise between high permittivity (k) and thermal stability during processing. Using model oxide mixtures based on hafnon, we have examined the stability before and after annealing using static density functional theory and ab initio molecular dynamics. We find that hafnium silicates are thermodynamically unstable with respect to HfO2 and SiO2.
SiO2-rich silicate
SiO2-rich mixture (blue=Hf, yellow=Si, red=O).
Mechanisms of segregation on the atomic scale are elucidated, showing why SiO2-rich mixtures undergo spinodal decomposition to give 4-coordinate Si (left). By contrast, HfO2-rich phases are metastable, but also decompose during annealing below typical process temperatures to give 6-coordinate Hf (right). HfO2-rich silicate
HfO2-rich mixture (blue=Hf, yellow=Si, red=O).
Publication Volume Pages Year Publication Title List of Authors
J APPL PHYS 97 114911 2005 Thermal decomposition mechanisms of hafnium and zirconium silicates at the atomic scale S. Monaghan, J.C. Greer, S.D. Elliott
  Simon Elliott, Scott Monaghan, Jim Greer HIKE project and SFI Investigator project

 

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