Prof. Peter O’Brien chaired the photonic packaging working group at the first World Technology Road-Mapping Forum for Integrated Photonics. Peter is Director of PIXAPP Photonics Packaging Pilot Line, Head of the Photonics Packaging Group at Tyndall and Deputy Director of IPIC.
The objective of this first world technology forum was to generate a baseline technology roadmap for integrated photonics for the next 10 to 15 years. A detailed road-map report will be prepared as a key output of the forum, and updated on a continuous basis.
Attendees to the forum travelled from across Europe, the United States and Asia, with many companies and research organisations represented, including PIXAPP, AIM Photonics and leading integrated photonic foundries. The forum will be an annual international event going-forward, and the number of invitees will increase as integrated photonics extends its reach across the globe.