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Leader in Integrated ICT Hardware & Systems

Senior Scientist - MEMS Device and Technology Integration

HC-1 Senior Scientist - MEMS Device and Technology Integration

Contract: Full Time/Fixed Term

The Tyndall National Institute is a world leader in the development of Information and Communications Technologies (ICT), with a primary mission to deliver economic impact through outstanding research coupled with world leading infrastructure, capabilities and expertise. In pursuit of this aim, Tyndall has developed an extensive network of national and international industrial collaborators and commercial clients, ranging from indigenous start-up companies to global giants. Examples of our industrial partners include Intel, Analog Devices, Boston Scientific, Sanmina and Huawei. Tyndall now has research contracts with 4 of the world’s top ten Medtech companies and has researchers-in-residence from eleven companies embedded within our research teams. With a network of over 200 industry partners and customers worldwide, Tyndall generates around €35M income each year, 85% from competitively won contracts.

Tyndall is currently engaged in an ambitious MEMS development strategy that is leveraging our core strengths in human capital, global networks and world-class infrastructure to develop the next generation of MEMS devices for smart systems, sensors & actuators, and radio frequency (RF) front-end modules. In particular, Tyndall has recently received significant funding to develop a state-of-the-art piezoelectric MEMS platform capability to enable both R&D and industry-aligned technology development of advanced acoustic MEMS devices and systems, with emphasis on biomedical / health, environmental sensing and biosensing, biometrics and authentication, and RF industries. 

As a result, the Tyndall National Institute is therefore seeking an experienced professional with a well-round profile in semiconductor and MEMS manufacturing to join our development team. Reporting to the Principal Researcher, MEMS, the mission of the Senior Scientist, MEMS Device and Technology Integration, is to build a thin-film piezoelectric-based MEMS platform from scratch with best industry standards on 200-mm MEMS technology. In the long term, the Senior Scientist, MEMS Device and Technology Integration shall do leading-edge R&D on novel MEMS devices using the developed platform, and shall seek opportunities for industrial partnerships and technology transfer. (Tyndall fosters start up efforts).

The roadmap to build such Piezoelectric MEMS platform encompasses hands-on development of the technological modules of the platform, definition and characterization of modules’ specs, integration of the modules into a robust process flow, definition and characterization of process control monitoring structures (PCMs) and test vehicles, wafer-level packaging of MEMS devices in the platform, and process optimization toward pilot-line, product-oriented MEMS prototyping.

Key Responsibilities

  • The successful candidate will mainly be responsible for the following:
  • Building and managing R&D activities aligned with the piezoelectric MEMS roadmap for material development, devices, and applications
  • Growing and leading a team of scientists in the area of new piezoelectric MEMS devices, including supervision of graduate students and post-docs
  • Contributing towards development of Intellectual Property and patents, and publications
  • Seeking funding opportunities and writing grant proposals to secure funding sources from public agencies and industrial partners
  • Feasibility assessment for new MEMS platform development, identify process gaps, new tools/ materials requirements
  • Development of novel (IP) process integration schemes leading to new piezoelectric MEMS products
  • Preparation, execution and management of MEMS tapeouts
  • Process flow creation for module development short loops and device integration full loops; and running the short-loop and full-loop lots
  • Development of characterization and validation methodologies of new process integration schemes and materials
  •  Establishing design rules and success criteria for each of the critical process steps
  • Designing and performing DOEs to validate process robustness
  • Participate in Education and Public Engagement activities as required
  • Ensure all activities are compliant with Tyndall Quality management system
  • Ensure all activities are compliant with the required health and safety standards
  • Carry out any additional duties as may reasonably be required with the general scope and level of the position
  • Perform other related duties as directed and as necessary for the work of the Piezo MEMS team.

Essential Criteria

  • Master’s Degree in a relevant discipline (Electronics, Physics, Chemical, Materials, etc.) and minimum of 8 years relevant post graduate experience
  • Track record of successful process integration experience in semiconductor industries.
  • Process characterization, including one or more of the following: in-line metrology tools, in-line process parameter characterization using statistical software analysis tool such as JMP, Klarity ACE; E-test / wafer sort programs, instrumentation, and setup design; post-fab electrical /mechanical characterization of test vehicles

Desirable Criteria

  • PhD in a relevant discipline (Electronics, Physics, Chemical, Materials, etc.) and minimum 4 years relevant experience
  • Previous experience in piezoelectric materials and acoustic wave devices
  • Experience with aluminum nitride (AlN) / Sc-doped AlN integration
  • Experience with 200-mm fab process integration
  • Experience in liaising with customers
  • Modeling and design of test devices, including one or more of the following: Process simulation and verification using tools such as Semulator3D (Coventor), Sentaurus (Synopsys); multiphysics (FEM) or numerical modeling using Comsol, ANSYS, Coventor, Matlab, Spectre, or similar tool; physical layout design using Cadence, Mentor or similar tool

Informal queries can be emailed to Humberto Campanella at humberto.campanella@tyndall.ie.

Appointment, dependent upon skills and experience, may be made on the Grade 6 (€49,181 - €58,719) or Grade 6a (€58,799 - €74,228) salary scale. Salary placement on appointment will be in accordance with public sector pay policy.

Closing Date for applications is 17:00 on 19th September, 2019.

Application Instructions

Step 1 - Click here to download and complete the Application form and indicate HC-1 as Job Reference

Step 2 - Return completed Application form, together with your CV and motivation letter to careers@tyndall.ie.

Handwritten forms will not be accepted. 

For an information package including full details of the post, selection criteria and application process click here.

The University, at its discretion, may undertake to make an additional appointment(s) from this competition following the conclusion of the process.

Please note that Garda vetting and/or an international police clearance check may form part of the selection process.

The University, at its discretion, may undertake to make an additional appointment(s) from this competition following the conclusion of the process.

Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.

At this time, Tyndall National Institute does not require the assistance of recruitment agencies.