PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, hosted at Tyndall National Institute, UCC, today announced the introduction of two new prototype packaging platforms to enable the early-stage testing and evaluation of integrated photonic devices.
PIXAPP.
The PIXAPP Grating Coupler Based Generic Packages (PIXAPP-GCP-10 and PIXAPP-GCP-100) are now available to users that need fast and cost-effective packages for PICs with <22 DC electrical connections. “Off-the-shelf” designs are available in volumes from 10 to 1000 units for rapid prototyping using the PIXAPP-GCP-10 design. For PICs with larger electrical and optical connections, the more flexible PIXAPP-GCP-100 design is available. These prototype packages add to PIXAPP’s established advanced photonic packaging services, helping its users speed-up the development of their new photonic-based products.
PIXAPP.
The prototype packages offered are based on PIXAPP’s standardised packaging building blocks, including standardised optical and electrical interconnects, thermal and mechanical components. Since 2017, PIXAPP has led and coordinated efforts by the Europe’s photonics packaging industries to standardise manufacturing processes and the supply chain, working with design houses, device foundries, companies providing packaging services and components, and manufacturers of advanced packaging equipment.
“We are excited about the launch of these new standard prototype packages that support companies in the early stage of product development and evaluation. We expect this packages will benefit users across many application areas, including optical communications, medical devices and other emerging industrial markets” said Peter O’Brien, director of the PIXAPP Pilot Line.
About us: PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, provides companies with standardised packaging solutions for prototyping and pilot-scale production. PIXAPP offers a comprehensive building block menu to its users including optical and electrical packaging, thermal control and mechanical assemblies. PIXAPP is serving key industries such as medical, sensors, security and optical communications. PIXAPP aims to drive the future demand for PIC-based products by developing standardised packaging processes and by supporting the complete manufacturing supply chain. A key focus of PIXAPP is to establish a set of packaging design rules and process design kits which provides users with easy access to well-defined and qualified packaging technologies.
PIXAPP has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N° 731954, in Public Private Partnership with Photonics 21.