Tyndall MagICians make magnetics disappear onto silicon chips
We are proud to share that today Tyndall National Institute received an EARTO Innovation Award during a virtual ceremony. The award in the Impact Expected category, is for the development of the MagIC platform, which delivers thin-film micro-magnetics components that can enable dramatic reductions in electronic system energy use. Congratulations to everyone involved!
Congratulations to our peers in CEA who received an award for the Impact Delivered category for the development of a patented Smart Cut process of substrate fabrication with SOITEC, resulting in a transfer of a thin active layer of silicon from one substrate to another, which can be used in all electronic devices.
Read the full press release from EARTO here.