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Leader in Integrated ICT Hardware & Systems

Frank Stam - Staff Researcher

Frank Stam

Contact

+353 (0)21 2346110
frank.stam (at) tyndall (dot) ie

  • MNS (Circuits and Systems)

Research Grants

  • Microsystem integration based on electroactive polymer gels for cardiovascular applications. (European Union) €713,798.00 (01-SEP-10 / 30-OCT-14)
  • INCITE IR-2015-0029 (Enterprise Irl) €373,153.00 (01-JAN-15 / 31-MAR-18)
  • EI FP/2010/674 Travel Support (Enterprise Irl) €560.00 (04-JUN-10 / 30-JUN-12)
  • [EI REF: ATRP/01/336] {Stam, Dr. F} N (Enterprise Irl) €346,004.00 (01-JAN-02 / 31-DEC-03)
  • [EI Contract ST/2000/053]{Stam,Dr.F.} N (Enterprise Irl) €45,584.00 (01-OCT-00 / 30-SEP-02)
  • Travel Support (Enterprise Irl) €900.00 (23-FEB-10 / 23-MAY-10)
  • [EI ATRP/02/415B] {Stam, Frank} N (Enterprise Irl) €174,800.00 (01-NOV-02 / 31-OCT-05)
  • EI Travel Support FP7 ICT02009-5 (Enterprise Irl) €1,100.00 (22-JUN-09 / 02-NOV-09)

Books

YearPublication

Peer Reviewed Journals

YearPublication
2016 Crystallinity and mechanical effects from annealing Parylene thin films
Jackson, N;Stam, F;O'Brien, J;Kailas, L;Mathewson, A;O'Murchu, C (2016) Crystallinity and mechanical effects from annealing Parylene thin films. : Thin Solid Films. [Details]
2015 Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications
Jackson, N;Stam, F (2015) Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications. : Journal of applied polymer science. [Details]
2015 A Cardiovascular Occlusion Method Based on the Use of a Smart Hydrogel
Jackson, N,Verbrugghe, P,Cuypers, D,Adesanya, K,Engel, L,Glazer, P,Dubruel, P,Shacham-Diamand, Y,Mendes, E,Herijgers, P,Stam, F (2015) A Cardiovascular Occlusion Method Based on the Use of a Smart Hydrogel. : IEEE Transactions On Biomedical Engineering. [Details]
2013 Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application
Jesudoss, P;Mathewson, A;Wright, WMD;Stam, F (2013) Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application. : Microelectronics Reliability. [Details]
2007 Voltammetric characterisation of silicon-based microelectrode arrays and their application to mercury-free stripping voltammetry of copper ions
Berduque, A;Lanyon, YH;Beni, V;Herzog, G;Watson, YE;Rodgers, K;Stam, F;Alderman, J;Arrigan, DWM (2007) Voltammetric characterisation of silicon-based microelectrode arrays and their application to mercury-free stripping voltammetry of copper ions. : Talanta. [Details]
2001 Application of amorphous silicon thin-film position-sensitive detector to optical rules
Martins, R;Teodoro, P;Soares, F;Ferreira, I;Guimaraes, N;Fortunato, E;Borges, J;Jose, G;Groth, A;Schultze, L;Berndt, D;Reichel, F;Stam, F (2001) Application of amorphous silicon thin-film position-sensitive detector to optical rules. : Advanced Engineering Materials. [Details]
2016 Widening the bandwidth of vibration energy harvesters using aliquid-based non-uniform load distribution
Nathan Jackson, Frank Stam, Oskar Olszewski, Hugh Doyle, Aidan Quinn, Alan Mathewson (2016) Widening the bandwidth of vibration energy harvesters using aliquid-based non-uniform load distribution. : Sensors and Actuators A-Physical. [Details]
2016 Evaluation of a Gelatin Modified Poly(?-Caprolactone) Film as a Scaffold for Lung Disease
Aleksandra Kosmalaa, Michelle Fitzgerald, Eric Moore, Frank Stam (2016) Evaluation of a Gelatin Modified Poly(?-Caprolactone) Film as a Scaffold for Lung Disease. : Analytical Letters. [Details]
2015 Electromechanical Properties of Carbon Nanotube Infused Polyacrylamide Hydrogel
Jackson, N;Sheehan, A;Hasan, M;Stam, F;Razeeb, KM (2015) Electromechanical Properties of Carbon Nanotube Infused Polyacrylamide Hydrogel. : Advances In Polymer Technology. [Details]
2015 An electro-responsive hydrogel for intravascular applications: an in vitro and in vivo evaluation
Verbrugghe P, Verhoeven J, Coudyzer W, Verbeken E, Dubruel P, Mendes E, Stam F, Meuris B, Herijgers P (2015) An electro-responsive hydrogel for intravascular applications: an in vitro and in vivo evaluation. : Journal Of Materials Science. [Details]
2014 A cardiovascular occlusion method based on the use of a smart hydrogel
Nathan Jackson, P. Verbrugghe, D. Cuypers, K. Adesanya, L. Engel, P. Glazer, P. Dubruel, Y. Shacham-Diamand, E. Mendes, P. Herijigers, F. Stam (2014) A cardiovascular occlusion method based on the use of a smart hydrogel. : IEEE Transactions On Biomedical Engineering. [Details]
2014 Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications
Jackson, Nathan and Stam, Frank (2014) Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications. : Journal of applied polymer science. [Details]
2013 3-D Interdigitated electrodes for uniform stimulation of electro-responsive hydrogels for biomedical applications
Jackson, Nathan and Cordero, Nicolas and Stam, Frank (2013) 3-D Interdigitated electrodes for uniform stimulation of electro-responsive hydrogels for biomedical applications. : Journal Of Polymer Science Part B-Polymer Physics. [Details]
2013 High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films
Smet, V,Jamal, M,Waldron, F,Stam, F,Mathewson, A,Razeeb, KM (2013) High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films. : Ieee Transactions On Components Packaging And Manufacturing Technology. [Details]
2013 Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application
Jesudoss, P,Mathewson, A,Wright, WMD,Stam, F (2013) Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application. : Microelectronics Reliability. [Details]
2007 Voltammetric Characterisation of Silicon-Based Microelectrode Arrays and Their Application to Mercury-Free Stripping Voltammetry of Copper Ions
Berduque, A, Lanyon, YH, Beni, V, Herzog, G, Watson, YE, Rodgers, K, Stam, F, Alderman, J, Arrigan, DWM (2007) Voltammetric Characterisation of Silicon-Based Microelectrode Arrays and Their Application to Mercury-Free Stripping Voltammetry of Copper Ions. : Talanta. [Details]
2001 The effect of power cycling on the reliability of lead-free surface mount assemblies
Davitt, Elaine and Stam, Frank A and Barrett, John (2001) The effect of power cycling on the reliability of lead-free surface mount assemblies. : IEEE Transactions On Components and Packaging Technologies. [Details]
2001 Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints
Stam, FA and Davitt, E (2001) Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. : Microelectronics Reliability. [Details]
2001 Application of amorphous silicon thin-film position-sensitive detector to optical rules
Martins, R,Teodoro, P,Soares, F,Ferreira, I,Guimaraes, N,Fortunato, E,Borges, J,Jose, G,Groth, A,Schultze, L,Berndt, D,Reichel, F,Stam, F (2001) Application of amorphous silicon thin-film position-sensitive detector to optical rules. : Advanced Engineering Materials. [Details]
1999 A simple modification of a flip-chip bonder to allow large area chip attach
Fuchs, S and Rindelhardt, K and Barrett, J and Stam, F (1999) A simple modification of a flip-chip bonder to allow large area chip attach. : Microelectronics International. [Details]
1998 Evaluation of adhesive based flip-chip interconnect techniques
Nagle, R and Stam, F and Barrett, J (1998) Evaluation of adhesive based flip-chip interconnect techniques. : International Journal of Microelectronics Packaging. [Details]
1995 CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY
STAM, F,OGRADY, P,BARRETT, J (1995) CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY. : Journal Of Electronics Manufacturing. [Details]
1993 Macro Requirement Within a Simulation Interface
Ahmad, M Munir and Stam, Frank A (1993) Macro Requirement Within a Simulation Interface. : Simulation. [Details]

Other Journals

YearPublication

Conference Publications

YearPublication
Year2017 PublicationSPIE Microtechnologies, Bio-MEMS and Medical Microdevices III
Frank Stam, Heikki Kuisma, Feng Gao, Jaakko Saarilahti, David Gomes Martins, Anu Kärkkäinen, Brendan Marrinan, and Sebastian Pintal (2017) Integration of a capacitive pressure sensing system into the outer catheter wall for coronary artery FFR measurements . In: Society of Photo-Optical Instrumentation Engineers (SPIE) eds. : . [Details]
Year2016 PublicationSENSORS AND ACTUATORS A-PHYSICAL
Jackson, N;Stam, F;Olszewski, OZ;Doyle, H;Quinn, A;Mathewson, A (2016) Widening the bandwidth of vibration energy harvesters using a liquid-based non-uniform load distribution. : . [Details]
Year2015 PublicationEurosensors
N.Jackson, F. Stam, O. Olszewski, R. Houlihan, A. Mathewson (2015) Broadening the Bandwidth of Piezoelectric Energy Harvester using Liquid filled Mass. : . [Details]
Year2015 PublicationEUROSENSORS 2015
Jackson, N;Stam, F;Olszewski, OZ;Houlihan, R;Mathewson, A (2015) Broadening the bandwidth of piezoelectric energy harvesters using liquid filled mass. : . [Details]
Year2011 Publication2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)
Jesudoss, P;Mathewson, A;Twomey, K;Stam, F;Wright, WMD (2011) A Swallowable diagnostic capsule with a direct access sensor using anisotropic conductive adhesive. : . [Details]
Year2010 Publication2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
Hilt, T;Boutry, H;Franiatte, R;Rothan, F;Sillon, N;Stam, F;Mathewson, A;Wang, NN;O'Mathuna, C;Rodgers, K (2010) DC/DC Converter 3D Assembly for Autonomous Sensor Nodes. : . [Details]
Year2009 Publication2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4
Stam, F;Razeeb, KM;Salwa, S;Mathewson, A (2009) Micro-Nano Interconnect between Gold Bond Pads and Copper Nano-Wires Embedded in a Polymer Template. : . [Details]
Year2003 PublicationPROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2
Norman, A;Stam, F;Ducso, C (2003) Reliability of micromachined catalytic gas sensors. : . [Details]
Year2002 PublicationSECOND JOINT EMBS-BMES CONFERENCE 2002, VOLS 1-3, CONFERENCE PROCEEDINGS
Piggott, JM;Berney, H;Hurley, E;Clair, J;Hofmann, M;Stam, F;Morrissey, A;Sheehan, MM (2002) Planar flexible electrode for use in wound sterilization. : . [Details]
Year1995 PublicationJOURNAL OF ELECTRONICS MANUFACTURING
STAM, F;OGRADY, P;BARRETT, J (1995) CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY. : . [Details]
Year2012 PublicationInternational Conference on Biomedical Engineering 2012
Jackson, Nathan and Verbrugghe, Peter and Embrechts, Anika and Herijgers, Paul and Mendes, Eduardo and Stam, Frank (2012) Reliability testing of Implantable Polyacrylamide Electroactive Hydrogels. : . [Details]
Year2011 PublicationBiofuture Conference 2011
Verbrugghe, Peter and Jackson, Nathan and Embrechts, Anika and Meuris, Bart and Stam, Frank and Mendes, Eduardo and Herijgers, Paul (2011) Swelling properties of polyacrylamide hydrogel for biomedical applications. : . [Details]
Year2011 PublicationIEEE International Reliability Physics Symposium (IRPS 2011)
Jesudoss, P; Mathewson, A; Wright, WMD; Twomey, K; Stam, F (2011) A swallowable diagnostic capsule with a direct access sensor using anisotropic conductive adhesive. : . [Details]
Year2010 Publication2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
Jesudoss, P;Chen, WB;Mathewson, A;Wright, WMD;McCarthy, KG;Stam, F (2010) Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor. : . [Details]
Year2010 PublicationElectronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Hilt, Thierry; Boutry, Herve;Franiatte, Remi;Rothan, Frederic;Sillon, Nicolas;Stam, Frank;Mathewson, Alan;Wang, Ningning;O'Mathuna, Cian;Rodgers, Kenneth (2010) DC/DC converter 3D assembly for autonomous sensor nodes. : . [Details]
Year2010 PublicationElectronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Jesudoss, Pio and Chen, Wenbin and Mathewson, Alan and Wright, William MD and McCarthy, Kevin G and Stam, Frank (2010) Electrical characterization of anisotropic conductive adhesive based flip chip for a direct access sensor. : . [Details]
Year2010 PublicationIMAPS International Conference on Device Packaging
Ramm, Peter and Lietaer, Nicolas and De Raedt, Walter and Fritsch, Thomas and Hilt, Thierry and Couderc, Pascal and Val, Christian and Mathewson, Alan and Razeeb, Kafil M and Stam, Frank and others (2010) The European 3D technology platform (e-CUBES). : . [Details]
Year2009 PublicationMicroelectronics and Packaging Conference, 2009. EMPC 2009. European
Jesudoss, Pio and Mathewson, Alan and Wright, William and McCaffrey, Colm and Ogurtsov, Vladimir and Twomey, Karen and Stam, Frank (2009) System packaging \& integration for a swallowable capsule using a direct access sensor. : . [Details]
Year2009 PublicationElectronic Components and Technology Conference, 2009. ECTC 2009. 59th
Stam, F and Razeeb, KM and Salwa, S and Mathewson, A (2009) Micro-nano interconnect between gold bond pads and copper nano-wires embedded in a polymer template. : . [Details]
Year2009 Publication2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2
Jesudoss, P;Mathewson, A;Wright, W;McCaffrey, C;Ogurtsov, V;Twomey, K;Stam, F (2009) System packaging & integration for a swallowable capsule using a direct access sensor. : . [Details]
Year2008 PublicationProc. XXXII International Microelectronics and Packaging IMAPS-IEEE CPMT Poland Conference (IMAPS-CPMT 2008)
Jesudoss, P. Mathewson, A; Wright, W; O'Flynn, B; Stam, F (2008) Effect of Solder Volume on joint shape with variable chip-to-board contact pad ratio. : . [Details]
Year2008 Publication26th International Conference on Microelectronics (MIEL 2008)
Jesudoss, P; Mathewson, A; Wright, W; Stam, F (2008) Evaluation of chip-to-board interconnection using variable aspect ratio contact pad areas . In: MIEL eds. : . [Details]
Year2008 Publication2008 26TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS
Jesudoss, P;Mathewson, A;Wright, W;Stam, F (2008) Evaluation of chip-to-board interconnection using variable aspect ratio contact pad areas. : . [Details]
Year2004 PublicationSENSORS AND ACTUATORS B-CHEMICAL
Barsony, I;Furjes, P;Adam, M;Ducso, C;Vizvary, Z;Zettner, J;Stam, F (2004) Thermal response of microfilament heaters in gas sensing. : . [Details]
Year2003 PublicationSENSORS AND ACTUATORS B-CHEMICAL
Norman, A;Stam, F;Morrissey, A;Hirschfelder, M;Enderlein, D (2003) Packaging effects of a novel explosion-proof gas sensor. : . [Details]
Year2003 PublicationSensors, 2003. Proceedings of IEEE
Norman, Aaron and Stam, Frank and Ducso, C (2003) Reliability of micromachined catalytic gas sensors. : . [Details]
Year2000 PublicationAdhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Vuorela, M and Holloway, M and Fuchs, S and Stam, F and Kivilahti, J (2000) Bismuth-filled anisotropically conductive adhesive for flip chip bonding. : . [Details]
Year1999 PublicationProceedings of the 1999 International Symposium on Microelectronics
Stam, FA and Davitt, E and Barrett, J (1999) Reliability testing of SnAgCu solder surface mount assembly. : . [Details]
Year1998 PublicationLasers and Electro-Optics Europe, 1998. 1998 CLEO/Europe. Conference on
Crean, GM and Paineau, S and Corbett, B and O'Connell, D and Rodgers, K and Stam, F and Kelly, PV and Redmond, G (1998) Hybridisation Issues for Optoelectronic Components. : . [Details]
Year1991 PublicationFactory Automation and Information Management - FAIM 1991
Stam, Frank A and Ahmad, M Munir (1991) PRELIMINARY STUDY ON DEVELOPING AN EXPERT SYSTEM FOR TAPE AUTOMATED BONDING. : . [Details]

Patents

  • US 20130245606
  • 990550
  • US 20110202152A

Employment

  • Senior Research Scientist, Tyndall National Institute (10-SEP-05 /)
  • Project Engineer, Digital Equipment Corporation (01-SEP-88 / 01-SEP-92)
  • Research Scientist, National Microelectronics Research Centre (10-SEP-92 / 10-SEP-05)

Education

  • Twente University, The Netherlands , MEngSc, Mechanical Engineering (1989)
  • Twente University, The Netherlands , BSC, Mechanical Engineering (1986)

Teaching Interests

Recent Postgraduates

  • Cian Clarke (NUI (UCC) Masters of Engineering Science) "Development of novel liquid metal electronic interconnects" (2017)
  • Pio Jesudoss (NUI (UCC) PHD) "Development and reliability of a direct access sensor using flip-chip-on-flex technology and anisotropic conductive adhesive" (2015)
  • Siti Salwa Mat Isa (UCC MEngSc) "Novel 3D Submicron Interconnect" (2007)
  • Nicolle Wilke (NUI (UCC) PHD) "Fabrication of microneedle arrays for drug delivery using wet etch technologies" (2004)
  • Daniel O’Keeffe (UCC MEngSc) "Design and fabrication of an on-chip potentiostat" (2003)
  • Elaine Davitt (UCC MEngSc) "The use of power cycling to compare the quality and reliability of Pb-free and Pb bearing surface mount solder joints" (2000)
  • Roger Nagle (UCC MEngSc) "Adhesive based flip-chip assembly" (1996)
  • Ken Hernan (UCC MEngSc) "Electroless and electroplating for flip-chip bonding" (1995)
  • Laurence O’Rourke (UCC MEngSc) "The integrated decoupling capacitor" (1994)
  • James O’Reilly (NUI (UCC) MEngSc) "Reliability and failure analysis of fine pitch IC package connection" (1993)
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