FRZ-2 Researcher - Hybrid Integration of SiC-based Sensors with Si Circuitry
Contract type: Full-time/Fixed Term
Tyndall National Institute at University College Cork invites applications for a position aimed at the research and development of integration of SiC- and Si-based devices by wafer bonding. This technology could be employed in the development of multi-wavelength integrated sensors, implantable SiC sensors, and in the integration of Si circuitry to high power electronic devices. The successful candidate will contribute to the design, development, integration, fabrication and demonstration of the SiC/Si wafer bonding technology and will work closely with other research groups in Tyndall, including the central fabrication facilities team. A particular emphasis will also be placed on the use of physics based modeling to gain an improved understanding of the electronic properties of the interfacial layer and its effects on the carrier transport mechanism. The experience gained in this role is very relevant to industry.
Informal enquiries can be made in confidence to Farzan Gity, email firstname.lastname@example.org
Appointment may be made on the IUA Researcher Scale €36,853 - €43,828.
Step 1 - click here to download and complete the application form
Step 2 - return the completed application form, together with your cv and motivation letter to email@example.com.
Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
The University, at its discretion, may undertake to make an additional appointment(s) from this competition following the conclusion of the process.
Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.
At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.