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Researcher in hybrid integration of SiC-based sensors with Si circuitry

FRZ-2 Researcher - Hybrid Integration of SiC-based Sensors with Si Circuitry

Contract type: Full-time/Fixed Term

Tyndall National Institute at University College Cork invites applications for a position aimed at the research and development of integration of SiC- and Si-based devices by wafer bonding. This technology could be employed in the development of multi-wavelength integrated sensors, implantable SiC sensors, and in the integration of Si circuitry to high power electronic devices. The successful candidate will contribute to the design, development, integration, fabrication and demonstration of the SiC/Si wafer bonding technology and will work closely with other research groups in Tyndall, including the central fabrication facilities team. A particular emphasis will also be placed on the use of physics based modeling to gain an improved understanding of the electronic properties of the interfacial layer and its effects on the carrier transport mechanism. The experience gained in this role is very relevant to industry.

Responsibilities

  • To contribute to mask design, bonding semi-processed wafers, and fabrication of integrated devices
  • To prepare characterisation setup and perform relevant characterisations
  • To develop a predictive device model to include the effects of interfacial amorphous layer at the bonded interface on the electrical and optical properties of the integrated devices
  • To contribute to planning, organising, conducting, and communicating research results and writing project reports
  • To interact with and present results to the industry partner on a regular basis
  • To collaborate with other Tyndall researchers and engineers to develop new ideas which advance the field 

Requirements

  • The candidate should have Master’s or PhD degree in Electronic Engineering, Materials Science, Physics, or related subject area.
  • The candidate should show their ability to work to a tight schedule while working effectively within a team and willing to work in the lab
  • Experimental planning and data collection/analysis skills
  • Good organisational, report writing and interpersonal skills
  • Good verbal and written communication skills

Desirable

  • Experience in semiconductor device fabrication, electrical and optical characterisation and analysis of semiconductor materials and devices is desirable.

Informal enquiries can be made in confidence to Farzan Gity, email farzan.gity@tyndall.ie

Appointment may be made on the IUA Researcher Scale €36,853 - €43,828.

Application Instructions

Step 1 - click here to download and complete the application form

Step 2 - return the completed application form, together with your cv and motivation letter to careers@tyndall.ie.

Please note that Garda vetting and/or an international police clearance check may form part of the selection process.

The University, at its discretion, may undertake to make an additional appointment(s) from this competition following the conclusion of the process. 

Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.

At this time, Tyndall National Institute does not require the assistance of recruitment agencies.

Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.