So much has changed since the first 3DIC conference in 2010!
3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources.
Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates.
The 2023 conference will focus on the research and science of 3DICs. It will cover relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.