With the rapid adoption of Artificial Intelligence (AI) and the exponential growth in compute power demands, the need for energy efficient and highly integrated power management solutions has never been greater.
Tyndall’s research is a key enabler in providing more efficient power solutions for the data centres of the future and has been instrumental in pushing the boundaries of semiconductor R&D.
This is achieved through our unique research approach to enable the delivery of world leading deep-tech solutions from atoms to systems with expertise across modelling, materials, processing and integration. This research is complemented and reinforced by engagements with industry partners across the full supply chain from materials and equipment suppliers, to passive component manufacturers, to semiconductor foundry’s and finally to system integrators and consumer electronics manufacturers whilst developing best-in-class talent pools to support the ambition of the sector.
Tyndall’s rapid-turn lab-to-fab on-site infrastructure, combined with globally renowned research physicists, chemists, and engineering teams, means that we host and collaborate with researchers-in-residence.
Our close collaboration with industry and academic partners alike means that we power new discoveries and innovations, contribute to sectoral growth, and address issues such as talent and supply shortages.
Tyndall provides industry partners with access to start-of-the-art pilot lines, resulting in Tyndall being an essential global research partner to a wide variety of companies.
Advanced Materials & Processes
We provide deposition and characterisation of functional thin films for electronics, energy and optical applications. We use materials growth and atomic scale processing, focusing on atomic layer deposition and thermal atomic layer etching. Advanced characterisation is offered, and we also employ several specialist techniques to explore 2D materials and their properties. Novel concepts, such as emerging devices and quantum technologies are also key.
We aim to deliver state-of-the art solutions for the achievement of quantum advantage using solid-stage platform technologies – low-power, energy-efficient, high-performance devices and architectures, while increasing functionality through novel materials integration.
Hyper-integration & Packaging
We combine semiconductor packaging technologies and silicon fabrication processes to create heterogeneous systems. Our research addresses challenges in photonic and microelectronic technologies, ranging from fundamental research to pilot-scale manufacturing. We closely collaborate with leading photonic equipment manufacturers to develop next generation solutions.
Circuits & Devices
Tyndall specialises in the modelling, simulation, analysis and design of nonlinear mixed signal circuits and systems for applications in communications and signal processing. We have expertise in techniques such as non-linear dynamical system theory and mixed-signal simulation.
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