The Tyndall Microsystems Packaging Laboratory offers a comprehensive range of capabilities to support detailed component analysis work along with the packaging and assembly of microelectronics and microsystems components. The packaging operation supports the research work of Tyndall’s advanced research groups along with supporting the prototyping needs of Tyndall’s external client base including both industry users, project partners and the European Space Agency (ESA).
The packaging capability includes all of the processes required to take integrated circuits from the wafer and assemble them in a variety of packaged formats. The full packaging process available in the laboratory include: Ceramic Packaging, Chip-on-Board (CoB) assembly, Plastic (Glob-top) encapsulated assembly and Multi-Chip Module (MCM) assembly.
These processes are typically used in low-volume to build prototype devices for the validation of new technologies or the investigation of novel materials or assembly techniques. The facility supports the development of new IC & Microsystems technologies through the provision of a support service by which new devices may be quickly packaged for test and characterisation purposes.
The major packaging tools available in the laboratory include:
An additional novel capability available in the laboratory is an LPKF Protolaser 3D functionalisation system. This system enables circuit patterns to be defined on 3D ojbects, e.g. plastic casings and supports the development of customised prototype packaging solutions for a wide range of applications.
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