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Leader in Integrated ICT Hardware & Systems

Micropower Systems & Nanomagnetics


Internet of Things (IoT) is regarded among the fastest growing technological platforms as it is predicted that there will be 25 billion of permanently connected things in few years’ time. The potentials of such a wirelessly connected ‘smart’ world are huge as it would flourish the information and communications technology market, save time and resources, and provide opportunities for innovation and economic growth. The IoT is expected to make our environment safer and responsive by providing a wealth of information through new forms of automation. However, a critical issue that constricts this vision is powering of billions of wirelessly communicating devices. Energy harvesting from ambience particularly from mechanical vibrations (which is otherwise unused) presents a straightforward and long-term solution for easily powering those remote devices using clean energy replacing the batteries while enabling the ‘fit-and-forget’ operations of the IoT.

On the other hand, the demand for efficient as well as miniaturized high frequency integrated magnetic passive elements such as microinductors, microtransformers and spintronics based memory devices requires extensive investigation on nano-structured next generation composite and patterned magnetic materials.

The focus of our group is oriented around the development of both the above technologies in terms of material to device, while addressing the different challenges faced by the cutting-edge research communities and leading industries.

Expertise/infrastructure within the group ranges from development of next generation, nano-structured hard and soft magnetic materials; design, modeling, fabrication of electromagnetic devices; and different state of the art structural, mechanical, magnetic, electrical characterization facilities




  • Numerical Simulation Tools – COMSOL Multi Physics, Maxwell Ansoft, OOMMF, Matlab, LabView
  • MEMS fabrication techniques - Lithography, DRIE, Oxidation, sputtering, electroplating.
  • Magnetic Characterization - SQUID Magnetometer, Wideband Permeameter, Quasi-static hysteresis loop tracer.
  • Vibration Test Set-up - Mechanical Shaker interfaced with control loop.
  • Structural - XRD, FESEM, EDX, HRTEM, DBFIB and electrical - cascade micro-probe station characterization.
  • Packaging - dicing, wire bonding, flip chip bonding.



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