Researchers at Tyndall and Keio University in Japan have come together to increase their research collaborations in the areas of semiconductors, photonics, and advanced packaging. Led by Professors Peter O’Brien of Tyndall and Takaaki Ishigure of Keio University, both groups will collaborate to help grow the research ecosystem between Europe and Japan. They will also focus on developing new training programmes for students and the future workforce. Prof. O’Brien was recently honoured with a Guest Professorship at Keio University to support this exciting collaboration. Prof. Ishigure and several of his PhD students visited Tyndall to start the collaboration.
Key areas both groups plan to address include:
- Investigation of novel optical and electrical packaging technologies for improved manufacturing.
- Design standardisation in advanced packaging, enabling a smoother transition of novel technologies from the research laboratory to commercialisation.
- Training students and the future workforce on advanced packaging technologies, from fundamental concepts to hands-on processes and equipment experience.
Looking ahead, Prof. O’Brien expressed his excitement about the future of this collaboration:
“I am honoured to accept the Guest Professorship at Keio University. The adoption of novel technologies requires collaboration at a global level. Japan has a fantastic track record in semiconductor and photonics research, and this collaboration will support closer engagement between Europe and Japan, ensuring we can realise a greater impact.”
Prof. O’Brien will travel to Japan later this year to continue this collaboration. He will also attend the IEEE CPMT Symposium on Innovation of Packaging Technology for Advanced Heterogeneous Integration, which will be held in Kyoto.
