Fei Tong
Specialty Products and Services
Fei is a Process Engineer at SPS in Tyndall, responsible for Physical Vapor Deposition (PVD)/Sputtering using Lesker and Nordiko systems, ICPCVD, HF vapor etching, and wafer bonding processes. Her wafer bonding expertise includes plasma-activated bonding with the AML system and anodic or adhesive bonding using the EVG system.
She holds a Master’s and PhD in Physics from Auburn University, Alabama, USA.
Click here to view Fei’s Google Scholar profile.
Contact Us
"*" indicates required fields