How Yuan Hwang
Photonics
Active in semiconductor packaging and process integration since 2009 such as STMicroelectronics and A*STAR-IME in Singapore as well as Analog Devices in Ireland. He is a graduate of National University of Singapore (B.Eng, M.Sc) and University College Cork (Ph.D) and has 5 granted patents on FO-WLP. His research interests are wafer level packaging, heterogeneous integration and passive optical coupling.
He’s currently developing photonic-electronic chiplet platform for modular packaging and managing various industrial/research projects within the group.
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