Saif Wakeel

Saif Wakeel is a Ph.D. student in the Photonic Packaging and Integration Group at Tyndall National Institute, University College Cork. He received Master Degree from University of Malaya, Kuala Lumpur, Malaysia in 2022 and Bachelor Degree from Aligarh Muslim University, India, in 2018. Before joining Tyndall, He was with NXP Semiconductors, Malaysia, for two years. He was also a Research Intern at the National University of Singapore (NUS), Singapore. He has spent a year of research exchange at Dicle University, Turkey under Erasmus+ program. His research interests include wafer-level photonic and electronic packaging, novel micro-optics and integration methods, micro-transfer printing, and the reliability of photonic packaging. He has authored several publications, and two invited books with 400+ citations. He is an incoming visiting student at Massachusetts Institute of Technology, USA with Wrixon research excellence fellowship.