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Leader in Integrated ICT Hardware & Systems

Simulation of Atomic Level Processing


The Materials Modelling for Devices Group, led by Dr. Michael Nolan applies multi-length scale simulations to challenges in atomic level processing. Semiconductor devices, materials for renewable energy and medical device coatings use atomic level processing to deposit or etch materials in ultra-precise structures.

Key technological challenges include developing processes for

  • Plasma deposition of metals of barrier layers and interconnects
  • Controlled etching of metals and high-k dielectrics
  • Process development for hybrid organic-inorganic coatings  

These processes are widely used in fabricating integrated circuits with high hopes for use in medical device technology.


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