Arun Kumar Mallik

Arun is a Senior Engineer in the Photonic Packaging and System Integration Group at Tyndall National Institute, a role he has held since June 2021. He received his PhD in 2018 from the Photonics Research Centre (PRC) at the School of Electrical and Electronic Engineering, Technological University Dublin.

With over nine years of experience, he is a dedicated and results-driven professional specialising in electronic design, photonic device integration, and advanced packaging. His core expertise includes 2.5D/3D hybrid integration, electrical interposer and PCB design, flip-chip assembly, high-precision free-space optical alignment, and fiber array attachment to silicon photonic devices. Additionally, he has significant experience in the application of optical fiber sensing technologies across diverse fields.

To date, he has authored or co-authored more than 30 peer-reviewed journal articles and presented his work at over 30 national and international conferences.

Click here to view Arun’s Google Scholar profile.