03 Sep 2026
Tyndall National Institute
Course Overview:
Packaging of photonic devices can account for over 50% of the manufacturing costs of a photonic product. Therefore, it is vital that anyone developing photonic based products have an understanding of the materials, technologies and processes required to package their photonic devices.
Learning Outcomes:
This three-day training course provides attendees, especially those involved in developing prototypes based on Photonic Integrated Circuits (PICs), with the fundamental technical skills in package design, assembly and reliability analysis.
Duration: 3 days
Cost: €500