Webinar Overview:
Micro-transfer printing (MTP) is an advanced heterogeneous integration technology that enables the precise placement of materials and pre-fabricated devices onto a wide range of substrates. It offers a powerful solution for integrating dissimilar materials in next-generation photonic and electronic systems.
This talk introduces the core principles of MTP, including pick-and-place transfer, stamp design, and interface adhesion. Key factors affecting transfer yield, alignment accuracy, reliability, and scalability will also be discussed.
The presentation will highlight recent MTP research at Tyndall National Institute, including III-V integration on silicon photonics, photonic and magnetic devices, and photonic packaging applications.
Finally, the webinar will explore the opportunities and challenges facing wider industry adoption of MTP and its potential to support high-volume manufacturing of future integrated systems.
Duration: 1 hour, October 12, 2:00 PM (UTC+1)
Funded by: IEEE EPS, Sensors Council, Systems Council and MEMS TC

