Tyndall’s Peter O’Brien has been announced as Conference Chair of AP International Conference 2027.
Taking place from 12-14 April 2027 in Brussels, Belgium, AP International brings together industry leaders, academic researchers and technology experts to explore the latest developments in advanced packaging. The conference will cover topics including chiplets, heterogeneous integration, packaging materials, thermal management and system integration.
Peter’s research focuses on the development and scaling of photonic and electronic packaging technologies for applications spanning AI, high-speed communications, quantum technologies and medical diagnostics. He leads numerous national and European research initiatives and industry collaborations, helping to shape the future of advanced packaging and photonics innovation.