26 May 2026
JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL
ECTC 2026
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
Dr Sambuddha Khan, Programme Manager, FAMES Pilot line, will present the paper ‘Tether-Free Micro-Transfer-Printing of Si-Based Micro-Inductors: Demonstration of On-Glass and In-Silicon Integration for PowerSoC Applications’ on Friday 29 May at 11:55am.
Find out more here.