Course Overview:
Overview of the technological processes involved in the fabrication and testing of semiconductor devices through the realization of red light emitting lasers on a GaAs substrate. Participants will be introduced to the state-of-the-art fabrication facilities and equipment available at Tyndall National Institute. By observing the various process steps, attendees will gain an understanding of how to safely carry out semiconductor device fabrication. Key fabrication techniques, including photolithography, wet and dry etching, chemical vapour deposition (CVD), and metallization, will be presented, along with the materials commonly used in photonic device fabrication. The course also includes laboratory sessions covering substrate handling, lift-off lithography, substrate thinning, device cleaving to form facets, and basic testing of the completed devices.
Learning Outcomes:
- Demonstrate an understanding of key sub-technologies, including photolithography, etching, metal deposition, thermal processing, and measurement techniques that together form the compound semiconductor device fabrication process.
- Demonstrate knowledge of the relationship between the materials used and the fabrication techniques applied, and understand how these combine to produce devices such as semiconductor lasers.
- Test a simple device and understand the relationship between process parameters and device performance.
- Recognise both the differences and similarities between silicon integrated circuit (IC) fabrication and compound semiconductor device fabrication.
- Fabricate a simple light-emitting device and understand the underlying technologies involved.
Duration: 4 days
Funded by: INFRACHIP