09 Sep 2026
Helsinki, Finland
Tyndall National Institute will play a strong and visible role at the IEEE Electronics System-Integration Technology Conference (ESTC) 2026 in Helsinki, showcasing cutting-edge research and innovation across photonics, advanced packaging, and chiplet integration.
A key highlight is Professor Peter O’Brien’s contribution to PDC 8, where he will address “Integrated Photonic Packaging – Materials, Processes, Equipment, and Scaling to Production.” This session will explore critical pathways for scaling photonic integration toward high-volume manufacturing.
Tyndall researchers will also present a series of papers demonstrating leadership in emerging packaging technologies, including:
- “Tapered Etch Profile Engineering Enabling Buried-Electrode Interconnects in Multilayer AlScN Piezoelectric Thin-Film Stacks” – Presented by Dr Sambuddha Khan
- “Silicon Interposer Technology for Advanced Chiplet-Based Packaging” – Presented by Arun Kumar Mallik
- “Cryogenic Edge-coupling Packaging Method of Photonic Chips using Annealed Adhesive” – Presented by Robert Bernson
- “Co-packaged Bio-imaging System on a Glass Interposer by Hybrid Laser Integration Using an Expanded Beam Approach” – Presented by Sharon M. Butler
