IMAPS Symposium 2026
The leading global conference for microelectronics and advanced packaging
September 28 – October 1, 2026
Encore Boston Harbor, Boston, Massachusetts, USA
The 59th International Symposium on Microelectronics, organised by the International Microelectronics Assembly and Packaging Society (IMAPS), will take place in Boston, Massachusetts. Recognised as one of the premier events in the field, the IMAPS Symposium delivers a comprehensive and high-quality technical programme focused on the latest developments in microelectronics and advanced packaging.
Each year, the symposium attracts a global audience of industry leaders, researchers, and innovators, alongside a strong cohort of first-time attendees, including early-career professionals, newcomers to the sector, and students.
In 2026, the symposium will be co-located with the Silicon Photonics Packaging Summit (October 1–2), creating a unique opportunity to engage with two complementary, cutting-edge events in one week.
The programme features an exceptional lineup of keynote speakers from across industry and academia, including:
- PR “Chidi” Chidambaram, Qualcomm
- Jean-Philippe Fricker, Cerebras Systems
- Ankur Aggarwal, Marvell Technology
- Keren Bergman, Columbia University
- Peter O’Brien, Tyndall National Institute
- M. Ashkan Seyedi, NVIDIA
Tyndall National Institute is proud to be represented among this distinguished group of speakers, with Professor Peter O’Brien contributing to the global discussion on the future of microelectronics and photonics packaging.
