Photonics Packaging & Integration Technologies Training

28 Apr 2026
Tyndall National Institute

This three‑day, hands‑on training course equips  industry, particularly professionals in photonic product development, with essential skills in package design, assembly, and reliability analysis.

Participants gain a solid grounding in optical, electrical, thermal, and mechanical aspects of packaging, along with insights into key equipment and reliability considerations.

The programme offers rare access to state‑of‑the‑art facilities, materials, and expert mentoring, providing a practical, industry‑focused learning experience.

For more information, visit Photonics Packaging & Integration Technologies – PhotonHub