Senior Engineer II – Photonic Packaging and Process Development

Senior Engineer II – Photonic Packaging and Process Development

About Tyndall
Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).

Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.

The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.

With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.

Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.

About the Team
The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Researcher in Component Fabrication and Integration for Advanced Packaging Technologies. This role focuses on the development of advanced component fabrication and integration technologies for photonic and electronic systems, including hybrid and heterogeneous integration approaches. The successful candidate will contribute to the development and optimisation of materials, processes, and integration methodologies that support next-generation packaging solutions and can be transferred to scalable manufacturing environments, including pilot line activities such as PIXEurope.

About the Role
The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Engineer II – Photonic Packaging and Process Development. This role focuses on the development of advanced photonic packaging technologies, processes, and integration methodologies for next-generation photonic and electronic systems. The successful candidate will contribute to the development and optimisation of packaging solutions that support high-performance photonic devices and can be transferred to scalable manufacturing environments, including pilot line activities such as PIXEurope.

A key aspect of the role will be the development of advanced packaging processes for emerging photonic applications, including low-loss cryogenic packaging technologies and advanced micro-optic integration approaches. The role will leverage Tyndall's advanced packaging, assembly, and characterisation facilities to develop innovative solutions that address challenges in quantum technologies, communications, sensing, and other advanced photonic applications.

The successful candidate will provide technical leadership in photonic packaging and process development activities, support the delivery of strategic programmes such as P4Q, lead technical projects, contribute to major funding proposals, develop collaborations with academic and industrial partners, and support the growth and development of engineers and researchers within the group.

Key Duties & Responsibilities
Reporting to the Head of the Photonics Packaging and Systems Integration Group, the Senior Engineer II will:
 

• Provide technical leadership in photonic packaging, process development, and advanced photonic integration technologies.
• Manage the development of low-loss cryogenic packaging solutions and advanced micro-optic integration technologies, including 3D printed micro-optics for photonic devices.
• Lead and manage technical projects, ensuring delivery of project objectives, milestones, and high-quality outcomes.
• Develop new packaging processes and capabilities with a focus on automation, scalability, manufacturability, and industrial deployment.
• Play a significant role in the development of large-scale proposals, including proposal writing, consortium development, work package planning, technical leadership, partner coordination, and defining project activities and deliverables.
• Build collaborations with academic, industrial, and research partners that support future funding opportunities, research activities, and commercial engagement.
• Support and mentor engineers, researchers, and students, contributing to the development of technical expertise within the group.
• Ensure all activities support and are compliant with the Tyndall Quality Management system.
• Ensure all activities support and are compliant with the required Health and Safety standards.
• Carry out any additional duties as may reasonably be required within the general scope and level of the post.

Essential Criteria

• Master’s Degree qualified with typically eight years academic and/or industrial experience.
• Strong technical expertise in photonic packaging technologies, including optical assembly, active alignment, photonic device integration, packaging process development, and advanced packaging platforms.
• Experience in cryogenic photonic packaging and advanced micro-optic integration technologies, including 3D printed micro-optics for photonic devices.
• Experience managing technical projects and leading activities across multidisciplinary teams.
• Evidence of developing technical capabilities and contributing to the growth of a research or engineering group, including mentoring junior staff.
• Demonstrated significant contribution to the development of large-scale proposals, including activities such as proposal writing, consortium development, work package planning, technical leadership, partner coordination, and defining project activities and deliverables.
• Experience in building research or industry collaborations that have the potential to generate future funding opportunities, research activities, or commercial engagement.
• Evidence of establishing an external profile through invited talks, conference presentations, technical training activities, or participation in international collaborations.
• Proven ability to manage and support project teams, with excellent communication skills and the ability to work effectively across multidisciplinary research, engineering and industry teams.
• An appetite for professional growth, with the potential and ambition to take on increasing technical, strategic and leadership responsibility as the team develops.

Desirable Criteria

• Experience developing alignment and packaging routines using advanced photonic packaging platforms such as ficonTEC FL300 and/or CL1500 systems.
• Experience in optical packaging processes for fibre array attachment to silicon photonics and InP-based photonic integrated circuits.
• Knowledge of microoptics design is considered an advantage.
• Experience characterising photonic and optoelectronic devices, including optical calibration, warpage measurements, fibre coupling, laser alignment, and performance evaluation.
• Experience supporting the transfer of advanced packaging technologies towards manufacturing environments and pilot line activities.
• Experience mentoring, coaching or providing technical leadership to engineering, students and project teams.

What We Offer

Apart from offering a position in a very successful and positive research environment, with a collaborative ethos full of diverse competencies to boost your career, we offer the following:
 

• Impactful Work: Opportunities to contribute to ground-breaking research and innovation that shape Ireland’s economy and the society at large.
• Continuous Learning: Strong support for formal training, further study and professional development.
• Interdisciplinary Environment: Where academia, industry, and innovation intersect - supported by cutting-edge infrastructure and expert knowledge.
• Blended Working: Flexibility to work remotely and on-site, where the role allows.
• Comprehensive Benefits: Access to UCC pension, long-term illness benefit, life assurance, and more.
• Generous Leave: Competitive annual leave entitlements.
• Equity & Inclusion: Athena Swan Bronze award holder, with ongoing initiatives led by a dedicated People and Culture team to ensure equity for all.
• Core Values: A culture grounded in Ambition, Collaboration, Diversity, Excellence, and Integrity.
• Entrepreneurial Spirit: A proactive, innovation-driven environment that welcomes entrepreneurial and creative thinkers, including those with start-up experience.
• Supportive Onboarding: Structured induction and mentoring to help new hires integrate and thrive.
• Vibrant Culture: A collaborative, people-first workplace with a strong sense of community.

Terms of Employment
Contract Category: Full-Time
Contract Type: Fixed Term

Appointment may be made on the Admin II Grade 6A Scale B (new entrants) salary €72,765 - €92,172 per annum. Salary placement on appointment will be in accordance with the public sector pay policy.

Informal enquiries can be made in confidence to Professor Peter O’Brien.
Closing date for applications for this position is 1pm, 9th October 2026.

Application Instructions
Please make sure to attach an up-to-date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.

A full candidate information pack is available to download by clicking here.

Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
Please note that an appointment to posts advertised will be dependent on university approval, together with the terms of the employment control framework for the higher education sector.

Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.