The photonic packaging group at Tyndall has been selected to bring advanced packaging and system integration services to Europractice. Collaborating with IMEC, STFC-UKRI, Fraunhofer-IIS and CMP, Tyndall will now manage the provision of advanced photonic, electronic and MEMs packaging and system integration services. The initiative is called ‘Next Europractice eXtended Technologies and Services (NEXTS) and is funded by the European Union’s Horizon 2020 research and innovation programme (Grant Agreement No 825121). Europractice has supported the European academic sector with design tools and Integrated Circuit prototyping for almost 30 years. The NEXTS initiative will build upon the well-established, widely-used and successful services offered by the partners, extending the service to SMEs, encouraging new users from non-traditional sectors, adding new technologies to serve new markets, diversifying the service towards smart system integration and packaging, and support the training of future generations of scientists and engineers required for the growing digital economy in Europe.
Prof. Peter O’Brien, head of photonics packaging at Tyndall said ‘We are delighted to support this new capability within Europractice and offer users the ability to develop more advanced integrated systems. Packaging and system integration technologies are compatible across many technology domains, from photonics and electronic to MEMs. Our expertise in advanced packaging will greatly impact on the development of highly integrated systems for a wide range of applications, from high-speed communications, to minimally invasive medical devices and sensors.’
Further details of new Europractice initiative is available at - https://www.imec-int.com/en/articles/europe-secures-europractice-services-to-european-academia-and-industry-until-end-2021