Professor Peter O’Brien, Head of the Photonics Packaging Group at Tyndall National Institute, recently visited Japan to strengthen Ireland’s position as a global leader in advanced semiconductor packaging.
His visit took him to key innovation hubs including Osaka, Niigata, Nagano, Tokyo and Kyoto, where he met with leading research partners and industry stakeholders. A highlight of the trip was a series of strategic meetings held in collaboration with IDA Ireland at the newly opened Ireland House in Tokyo, a symbol of Ireland’s growing presence in Asia.
During his time in Tokyo, Professor O’Brien delivered an invited talk on advanced packaging to the IEEE Japanese Electronic Packaging Society at the National Institute of Advanced Industrial Science and Technology (AIST). He also chaired the photonics session at the IEEE Symposium on Components, Packaging and Manufacturing Technology at Kyoto University, contributing to global dialogue on the future of semiconductor and photonics technologies.
Commenting on his visit, Professor O’Brien said:
Japan continues to be a global powerhouse in semiconductor innovation, its deep expertise and commitment to collaboration make it an essential partner as we advance the future of photonics and packaging.
Professor O’Brien’s visit reflects Tyndall’s strong commitment to international collaboration and innovation, while underscoring the strategic role of photonics and packaging in shaping the future of the global semiconductor industry.
