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Leader in Integrated ICT Hardware & Systems

Packaging

Photographs from the Photonic Packaging Lab at the Tyndall National Institute

The Photonics Packaging and Integration Group is led by Peter O’Brien. The group was established in 2009, has 15 fulltime researchers and 2 PhD students. The group has grown rapidly and formed a large number of international collaborations with both industry and academia, and is recognized for it’s ability to convert research results generated in the laboratory to commercialization. The group has also formed collaborations with numerous Photonic Integrated Circuit (PIC) initiatives in Europe and the US, including ePIXfab, Europractice and JePPIX, where they support advanced assembly and packaging requirements for users of these MPW services. They have also prepared the world’s first set of packaging design rules and collaborated with Phoenix and Luceda Photonics to incorporate these into their software design kits.

The group has established an impressive range of packaging capabilities including; fiber optical packaging (Newport auto align & Nanosystec laser welder), micro optical assembly (Nanosytec nano-glue), semi- and fully-automatic flip- chip bonding with submicron precision (2 Finetech and new system approved for purchase with €1M budget), micro solder deposition using jetting technology (Pactech), ball and ribbon wire-bonding (3 systems), polymer embossing system (Jenaoptik), x-ray microscope inspection (Nordson), ultrasonic microscope (Sonoscan), environmental test chambers (multiple Heraeus systems), and wide range of optical and electron microscope systems for package analysis. These capabilities are supported by advanced design, including; optical (Lumerical and Zemax), electrical (HFSS and ADS), thermal (ANSYS and Comsol) and mechanical design (Solidworks). These capabilities have enabled the group to delivery full packaging solutions to many companies and academic researchers. Critically, the group supports multiple industrial sectors, with particularly strong collaborations in the areas of communications, medical devices and sensors.

– Packaging a pair of multi-channel Fibre-Arrays to a Si-PIC (Silicon Photonics Integrated Circuit)
Packaging a pair of multi-channel Fibre-Arrays to a Si-PIC (Silicon Photonics Integrated Circuit)
Packaged InP Photonic Integrated Circuit, including welded fiber optics, control electronics and temperature controller
Packaged InP Photonic Integrated Circuit, including welded fiber optics, control electronics and temperature controller
Integrating a “tilted” VCSEL (vertical-cavity surface-emitting laser) directly on top of a Si-PIC, for low-loss insertion into a grating-coupler structure
Integrating a “tilted” VCSEL (vertical-cavity surface-emitting laser) directly on top of a Si-PIC, for low-loss insertion into a grating-coupler structure
Photograph of a CMOS RF-driver driver flip-chip integrated on top of a Si-PIC, and wire-bonded to a PCB with SMT front-end electronics.
Photograph of a CMOS RF-driver driver flip-chip integrated on top of a Si-PIC, and wire-bonded to a PCB with SMT front-end electronics.
Optical and Thermal image of fully-packaged ONU (optical network unit) for a NG-PON (next generation passive optical network), showing the elevated temperature of the Si-PIC and flip-chip integrated RF-driver during operation
Optical and Thermal image of fully-packaged ONU (optical network unit) for a NG-PON (next generation passive optical network), showing the elevated temperature of the Si-PIC and flip-chip integrated RF-driver during operation

 

CMOS RF-driver driver flip-chip integrated on top of a Si-PIC. There are 484 20m diameter copper pillar electrical connections between the two chips
CMOS RF-driver driver flip-chip integrated on top of a Si-PIC. There are 484 20mm diameter copper pillar electrical connections between the two chips

 

The IPIC Team - Peter O'Brien from Standpoint Media on Vimeo.

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