The Photonics Packaging and Systems Integration Group at Tyndall addresses challenges in photonic and microelectronic technologies, from fundamental research to the transition to pilot-scale manufacturing.
The group has unique technical expertise across a wide range of advanced photonic and microelectronic packaging and integration technologies.
They have state-of-the-art simulation, design and production facilities, using the latest packaging equipment to deliver initial prototypes through to low-volume production. Key areas of activity include wafer-level packaging for mass-market photonics, optical and electrical interposers, RF photonic-electronic integration, heterogenous integration using transfer print technology, quantum photonics and quantum system engineering, the transition of prototypes to manufacturing, and workforce education and training.
The group produces advanced prototypes and routes to manufacture for the following application areas - high-speed communications, healthcare and biosensing, remote sensing including LIDAR, augmented and virtual reality, quantum communications and computing, and artificial intelligence.
To complement the group's considerable expertise, leading photonic equipment manufacturers have established application teams with the group. This includes ficonTEC and X-Celeprint. These companies have located state-of-the-art equipment and highly experienced engineering teams who collaborate with the group to develop next-generation solutions for high-throughput photonic-microelectronic manufacturing.
The group leads flagship research programmes and manufacturing initiatives, including the European Photonics Packaging Pilot Line, the European Photonics Academy, and the breakthrough wafer-level packaging project PhotonicLEAP. They also participate in large-scale European research initiatives, such as the Quantum Flagship Programme, where they are involved in the development of photonic and electronics packaging technologies for emerging quantum applications, and Europractice, which supports the growth of a microelectronic design ecosystem in Europe. The group is involved in over 15 EU projects, multiple Science Foundation Ireland, National Science Foundation and DARPA projects. They also manage many industrial research projects with leading multinationals and SMEs. These industry engagements typically involve the delivery of advanced system prototypes and establishing routes to volume manufacture.
The Photonics Packaging & Systems Integration Group is a highly experienced and dedicated team of skilled researchers, engineers, project managers and PhD students. The group is led by Prof. Peter O'Brien, who brings considerable academic and industry experience. He has been awarded over 45M Euros in competitively won funding over the past six years and has established an extensive collaboration network worldwide with leading academic and industry researchers.
Please contact us if you are interested in collaboration or wish to learn more about our research.