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John Tyndall
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Research
Micro & Nano Systems
Emerging Materials & Devices
Nano Materials for Sensing
Flexible Surface Enhanced Raman Scattering Substrates for Trace Analysis
Electrochemical Materials & Energy
Atomic Layer Deposition
Chemical Vapour Deposition
Simulation of Atomic Level Processing
Metal ALD
Atomic Layer Etching
Hybrid Materials Deposition
Materials Theory
Ultrafast Photoexcitation of Materials
Thermoelectric Materials
Piezoelectrics Materials for Energy Harvesting & Sensing
Advanced Energy Materials
Nano Interconnect
High Temperature Die Attach
Smart Materials
Development & Electrical Characterisation of Emerging Devices
High K
III-V
Molecular Monolayer Doping (MLD)
2D Materials & Devices
Nanomagnetics
Thermal Management
Thermo Electric Cooler
Thermal Interface Materials
Micro-Power Platforms
Energy Harvesting
Electromechanical – MEMS Vibrational Energy Harvesting
Thermoelectric Generator
Micropower Systems & Nanomagnetics
Piezoelectric
Energy Storage
Electrochemical Materials for Energy Storage
Hybrid Energy Storage
Integrated Magnetics
ICT4Energy Efficiency
Integrated Sensors & Actuators
Smart Agri Food & Nanosensor Systems
Nanoporous Materials
Nano Materials Based Sensor
Gas Sensing
On Farm Disease Diagnostics
IC Design MCCI
Smart Systems Integration
Wireless Sensor Networks
Biomechanics and Motion Monitoring
Smart Radio Systems
Location Aware Systems
Smart Systems Integration
Industry Interaction
Technology Transfer
Funding Mechanisms
HSI (Hetrogenous Systems Integration)
RF MEMS
Research Groups
Materials Modelling for Devices
Atomic Layer Deposition
Mechanism of Alumina ALD
Clean-up of III-V Oxides
Multi-Scale Simulation
Hafnia and Zirconia Precursors
ALD of Silicon-Based Materials
Deposition of Copper Metal
Functional Metals Oxides: Surfaces and Interfaces
Modified TiO2 Photocatalysts
Doped Ceria for Catalysis
Photocatalysis
Piezo MEMS
Piezo MEMS/BioMEMS
Energy Harvesting
Resonators
WSN (Wireless Sensor Networks)
Integrated Magnetics
Electrochemical Materials & Energy
Circuits & Systems
HSI (Hetrogenous Systems Integration)
LSI (Life Science Interface)
Electrochemical Sensor & Systems
Impedometric
Lab on a Chip
CE-Systems
Protein Detection on Chip
Multiparameter System for Monitoring Cell Health
Micro Transdermal Interface Platforms (MicroTIPs)
Dry Electrodes
Transdermal Drug Delivery
Diagnostics
Smart Dressings
Biomedical Microsystems
ICT for Health
Sensing and Separation Group
Nanotechnology
Advanced Materials & Surfaces
Micropower Systems & Nanomagnetics
CMOS++
WiLab
Photonics
Theory
III-Nitride Materials
III-V Nitride Growth
Devices
Electronics
Integration
Packaging
Communications (Photonic Systems)
Bio Photonics
Epitaxy and Physics of Nanostructures
Research
Quantum
What is the meaning of Quantum?
Quantum mechanics – Pure Science and not Magic
The EPR Paradox & Bell's Inequalities - Uncovering Quantum
Applications of Quantum Mechanics or collectively known as Quantum Technologies
People
Equipment
CAPPA
Quantum
Quantum Research Jobs
Tyndall Quantum Computer Engineering Centre (QCEC)
Tyndall QCEC Ecosystem
Funded Programmes
EU Programmes
EU H2020 Projects
Science Foundation Ireland Projects
Enterprise Ireland Projects
Tyndall Papers
Semiconductor Technologies
Quantum Technologies
Emerging IoT Technologies
Residential Retrofit Renovation
Heat Pump Targets & Solutions
Stefan Andersson Engels shares his path to Research Excellence
Education
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Postgraduate Research
Postgraduate Research Training Overview
Structured PhD Programmes
Student Publications
Postgraduate Publication of the Year 2019
Postgraduate Publication of the Year 2020
Postgraduate Publication of the Year 2021
Postgraduate Publication of the Year 2022
Prospective Postgraduate Research Students
Postgraduate Applications and Internships
Postgraduate Research Programmes
Postgraduate Research Opportunities
Relocating to Cork
About Cork
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On Arrival
Student Profiles
Current Postgraduate Research Students & Supervisors
Procedures, Policies and Student Supports
Training and Module Information
Wrixon Research Excellence Bursaries
Education & Public Engagement in Science and Research
STEM Education for Primary Schools
STEM Education & Careers for Secondary Schools
Tyndall Transition Year (TY) Programme
STEM Education & Events for the General Public
Science Experiments for Kids at Home
Tyndall Science At Home
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Careers
Current Vacancies
Quantum Computer Engineering Opportunities
Leadership, Professional Support & Technical Opportunities
DOH-23b Senior Research Engineer in Integrated circuit design for Inductive Powe
CH-11 People and Culture Manager, Tyndall National Institute, UCC
POB-59 Research Programme Manager
Research Opportunities
PT-42 Postdoctoral Researcher / Senior Research Engineer in Integrated Circuit d
RS-04 Senior Power Electronics Researcher in Integrated Magnetics Group
DP-19 Postdoctoral Researcher/ Scientist in RF Front-End Components and Antenna
VJ-01 PhD Researchers in Terahertz transceivers for Imaging and sensing
Scholarship Postgraduate Opportunities
EP-30b PhD - Quantum technologies with advanced site-controlled quantum dot stru
SOD-14b PhD Researchers in PMIC Circuit Design for Real Time Control of Multi-Le
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Benefits
Internships and Co-Op Placements
Internship as Microsoft 365 App Developer
Summer Fellowship Programme 2024
Relocating to Cork
About Cork
Pre-Arrival
On Arrival
Newcomers Guide to Cork
Work Authorisation
Alumni
Tyndall Alumni: Dr Beth Massey - The Energy Authority
Tyndall Alumni: Magaly V. Mora - Stryker Innovation Centre
Tyndall Alumni: Rory Cahill – Intel
Tyndall Alumni: Dr Silviu Bogusevschi - Microsoft
Tyndall Alumni: Dr Karen Twomey - CommScope
Tyndall Alumni: Dr Isabelle Ferain - GlobalFoundries
Tyndall Alumni: Dr Rathnait Long - MACOM Technology Solutions
Tyndall Alumni: Dr Zeinab Shaban - X-Celeprint
Tyndall Alumni: Dr Niamh Creedon- Deloitte
Equality Diversity & Inclusion
Empowering Women @ Tyndall
Marie-Curie Postdoctoral Fellowship
Marie Curie Postdoctoral Fellowship at Tyndall
Tyndall Early Career Researchers’ Network (TEC-Net)
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Services
Process & Product Development
Process Technology
DTE - Design Technology Evaluation Group
IC Design Characterisation
Intellectual Property Investigation
IC & Technology Assessment
TLP-ESD Characterisation
FPGA Design
OACF Characterisation Facility
Electron Microscopy
Electronics Packaging & Reliability Services
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Micro Electronics & Micro Systems Packaging
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ASCENT
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