The Materials Modelling for Devices Group, led by Dr. Michael Nolan applies multi-length scale simulations to challenges in atomic level processing. Semiconductor devices, materials for renewable energy and medical device coatings use atomic level processing to deposit or etch materials in ultra-precise structures.
Key technological challenges include developing processes for
Plasma deposition of metals of barrier layers and interconnects
Controlled etching of metals and high-k dielectrics
Process development for hybrid organic-inorganic coatings
These processes are widely used in fabricating integrated circuits with high hopes for use in medical device technology.