Breakthrough at Tyndall Revolutionises Surgical Navigation for Cancer Professor Pádraig Cantillon-Murphy, Manish Srivastava
Tyndall partners with MIT to develop sustainable semiconductor chips production processes Prof. Peter O’Brien giving a tutorial on advanced packaging at MIT in January 2024. His research team at Tyndall will partner in the FUTUR-IC project which is funded by the National Science Foundation.
