Leader in Integrated ICT Hardware & Systems
This project aims to develop next generation Thermal Interface Material (TIM) integrated directly on the thermal management system such as heat sink as a complete system level solution for efficient thermal management of the packaged semiconductor devices. The objective of this project is to fabricate these composite films directly onto the thermal management system (e.g. heat sink or liquid channel cooling system) and thereby reducing the thermal impedance by at least 50%. As the submicron wire-nanotube will be directly grown on the flat surface of the heat sink the overall thermal impedance will be reduced further and the end customer will be able to get a system level solution for thermal management.
The outcome of the project will be a range of Intellectual Properties (IP) covering the development and implementation of these new materials and their optimisation in physical design for thermal management systems capable of removing heat more efficiently. These IP's will be licensed to the industrial sector.
Dr. Ju Xu
Dr. Maksudul Hasan
Dr. Kafil M. Razeeb
Dr. Kafil M. Razeeb
Phone: +353 21 4904078
E-mail: kafil.mahmood (at) tyndall (dot) ie
Stokes Institute, University of Limerick