Leader in Integrated ICT Hardware & Systems
The main objective of this project is to develop an electrically insulated die level thermal interface material (TIM) system that has higher thermal conductivity than the existing state of the art thermal interface material.
It is strongly envisaged that nanotubes or nanowires as filler in thermal interface material has competitive advantage over commercial filler materials due to its high thermal conductivity. Moreover, the novel approach of fabricating the thermal interface layer using nanotube or nanowires in polymer matrix will assist in realizing better contact between die and package interface and effect of roughness of the interfaces will be minimized. This would eventually assist in maximizing substrate cooling.
The design, fabrication and characterization of the thermal interface layer are the three main aspects in achieving this objective. The performance of the TIM system will be evaluated through a practical application scenario. The key element of this system is nanotubes/ nanowires homogeneously distributed in polymer matrix.
Stokes Institute, University of Limerick