Thermal Interface Materials

Cross section of Tyndall's thermal interface material film showing submicron wires.
Cross section of Tyndall's thermal interface material film showing submicron wires.

Packaging of semiconductor power electronic device is a challenge due to the progressive increase in the power level of operating devices. In the near future, the power level will rise to about 200 W, or about an effective power density of 500 Win-2. In high-power electronics module packages, the heat generated by the power device is transferred to the ambient environment by attaching a heat spreader to the semiconductor package. The heat spreader is attached to the chip using a thermal interface material (TIM). It has been found that the TIM contributes ~50% to the thermal impedance of a complete package. Proper selection of TIM can be crucial for the device efficiency; and instead of having a big heat sink with sophisticated cooling technique; it is better to invest on the interface material.

The Nano-interconnection team in Tyndall National Institute is actively involved in researching novel thermal interface materials. The SEM image shown above is the metal-polymer composites fabricated in Tyndall. In this activity, Nano-Interconnection team is working on the fabrication and characterisation of thermal interface material systems using different types of nanotubes and nanowires as filler material.


Relevant Projects:


Patent Applications:

  1. Kafil. M. Razeeb, S. Roy, L. Nagle, J. Rohan, A thermal interface material, Patent App. No. WO2008129525-A1. EP Patent No. 2,162,910, US Patent App. No. 12/597,145, US patent accepted.
  2. Kafil M. Razeeb, Ju Xu, Eric Dalton, Saibal Roy and Alan Mathewson, A process for the manufacture of large area, homogeneous, ultra-long, one dimensional nanostructures on a solid substrate and the application of same, UK Patent Application No. 1013456.7. Filing date: 11 August 2010.


Selected Publications:

  1. Kafil M. Razeeb, Alessio Munari, Eric Dalton, Jeff Punch and Saibal Roy, Thermal Properties of Carbon Nanotube-Polymer Composites for Thermal Interface Material, 2007 ASME-JSME Thermal Engineering Conference and Summer Heat Transfer Conference, July 8-12, 2007, Vancouver, BC, Canada. [download pdf]
  2. Kafil M. Razeeb and Saibal Roy, Thermal diffusivity of non-fractal and fractal nickel nanowires, J.  Appl. Phys., 103(8), 084302, 2008. [download pdf]
  3. Ju Xu, Kafil M. Razeeb and Saibal Roy, Thermal Properties of Single Walled Carbon Nanotube-Silicone Nanocomposites, J. Poly. Sci. Part B: Poly. Phys., 46, 1845, 2008. [download pdf]
  4. Alessio Munari, Ju Xu, Eric Dalton, Alan Mathewson and Kafil M. Razeeb, Metal Nanowire-Polymer Nanocomposite as Thermal Interface Material, 59th Electronic Components & Technology Conference (ECTC 2009), 26-29 May, 2009, San Diego, CA, USA, pp. 448-452. [download pdf]
  5. Ju Xu, Alessio Munari, Eric Dalton, Alan Mathewson and Kafil M. Razeeb, Silver Nanowire Array - Polymer Composites as Thermal Interface Material, J. Appl. Phys., 106, 124310, 2009. [download pdf]
  6. Kafil M. Razeeb, Ju Xu, Eric D. Dalton, Muhammad M. Ramli, Maurice N. Collins and Saibal Roy, Thermal properties of carbon nanotube-silicone composites, Mikhail Lechkov and Sergej Prandzheva (Eds.), 2009, Encyclopedia of Polymer Composites: Properties, Performance and Applications, Nova science publishers, NY, ISBN: 978-1-60741-717-0, pp. 541-566. [download pdf]
  7. Kafil M. Razeeb and Eric Dalton, Nanowire-Polymer Nanocomposites as Thermal Interface Material, Advances in Nanocomposites - Synthesis, Characterization and Industrial Applications, Boreddy Reddy (Ed.), 2011, ISBN: 978-953-307-165-7, InTech, 685-706. [download pdf]

Dr. Kafil M. Razeeb

Phone: +353 21 4904078

E-mail: kafil.mahmood(at)

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