email: brendan.oflynn@tyndall.ie

Phone: +353-21-4904041

BIOGRAPHY:

Brendan O'Flynn received his BE Hons from University College Cork in 1993, and his M Eng Sc degree from University College Cork, National Microelectronics Research Centre in 1995. His thesis was on the reliability of novel packaging techniques for Bare die (chip on board) and Multi Chip Module (MCM) based systems - specifically in the area of Glop top encapsulation. He then worked as a Research Scientist at the National Microelectronics Research Centre, Cork, Ireland from 1995-1999 concentrating on European projects involving miniaturisation of microelectronic systems (CHIPPAC, Europractice MCM). His focus of research was Multi Chip module design and development, including the development of a technology market place for High Density Packaging Systems in Europe as part of the Europractice Programme.

As part of the management team for the Ambient Electronic Systems (AES) group within the Tyndall National Institute (incorporating the NMRC) Brendan has been responsible for the project management of industry funded and European projects; overseeing the day to day budget management and project administration (financial, personnel, delegation of work package responsibility etc.) and coordinating the activities of a multi-disciplinary team of researchers. He has been involved in the development of the AES Intern program, overseeing work placement students and various undergraduate programmes. His research into miniaturised wireless sensor systems has led to the publishing of a number of conference and peer reviewed journal papers and built up an international reputation for miniaturised wireless systems for the Ambient electronics team within Tyndall National Institute..