Many technologies require the deposition of materials in thin, high-quality films.  Examples in the electronics field include CMOS transistors, memories (DRAM, NVM/flash) and high value capacitors for RF decoupling and signal processing. Smaller, faster and more powerful capacitors and memories can be made if the materials can be fabricated in thinner and thinner layers. More efficient sensors, fuel cells and photocatalysts can also be manufactured if active materials can be deposited in thin layers. With scaling down to nanometre-thin layers, it becomes increasingly important to process these films in a controlled way and to understand the interfaces that dominate their properties.

We apply atomic-scale simulation to find out more about properties, processing and growth of these ultra-thin films. Our aim is to use computational chemistry and materials science to invent new materials and processes, that in turn will be part of future technological advances.

Atomic layer deposition (high-k dielectrics, metals and polymers)

Materials discovery (interactions, surfaces and interfaces)

Industry and technology partners:

We have joint papers or bilateral projects with:

• SAFC Hitech
• Intel Ireland
• Seagate Technology (Ireland)
• Henkel Ireland
• Analog Devices Ireland
• Johnson Matthey

In addition, we are involved in multi-lateral projects with other companies.

University collaboration:

We have joint papers or bilateral projects with:

• TU Eindhoven
• MDM National Laboratory
• Trinity College Dublin
• University of Liverpool
• University of Reading
• Strathclyde University
• University of Barcelona and here
• Kinki University (Osaka, Japan)
• Freidrich-Alexander University Erlangen-Nuremberg
• University of Osnabruck
• CSIC Madrid

as well as multi-lateral projects with other research groups world-wide. 

Our students are registered with University College Cork.