The EU-funded PhotonicLEAP project plans to develop a disruptive wafer-level photonic integrated circuit (PIC) module integration, packaging and test technology which can be scaled from low to very large volumes. The project will leverage the new developments to produce a surface mount technology (SMT) package that will incorporate for the first time multiple optical and electrical connections. PhotonicLEAP's SMT approach is set to become a new global standard for cost-effective PIC packaging and high-throughput PIC testing. The technologies will be validated in two state-of-the-art demonstrators: a high-speed optical communication module and a portable medical device for cardiovascular diagnostics. PhotonicLEAP's approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and opening completely new markets. 

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Funders: EU H2020 Projects, photonics21