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Leader in Integrated ICT Hardware & Systems



The EU-funded PhotonicLEAP project plans to develop a disruptive wafer-level photonic integrated circuit (PIC) module integration, packaging and test technology which can be scaled from low to very large volumes. The project will leverage the new developments to produce a surface mount technology (SMT) package that will incorporate for the first time multiple optical and electrical connections. PhotonicLEAP's SMT approach is set to become a new global standard for cost-effective PIC packaging and high-throughput PIC testing. The technologies will be validated in two state-of-the-art demonstrators: a high-speed optical communication module and a portable medical device for cardiovascular diagnostics. PhotonicLEAP's approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and opening completely new markets. 

To find out more about this project click here.

EU H2020 Projects, photonics21